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89HPES6T6G2ZCALG - Renesas Electronics

Description: Provides high-performance I/O expansion and switching functions between a PCIe upstream port and five downstream ports or peer-to-peer switching between downstream ports.

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89HPES6T6G2ZCALG - Renesas Electronics - PCB symbol
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89HPES6T6G2ZCALG - Renesas Electronics PCB footprint - BGA - BGA - ALG324
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89HPES6T6G2ZCALG Details

  • Manufacturer Part Number:

    89HPES6T6G2ZCALG

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    FCBGA

  • Package Description:

    FCBGA-324

  • Pin Count:

    324

  • Manufacturer Package Code:

    ALG324

  • Similar Group:

    CT00139318691008

  • ECCN Code:

    3A991.a.2

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Bus Compatibility:

    SMBUS

  • Clock Frequency-Max:

    100 MHz

  • Data Transfer Rate-Max:

    625 MBps

  • JESD-30 Code:

    S-PBGA-B324

  • JESD-609 Code:

    e1

  • Length:

    19 mm

  • Moisture Sensitivity Level:

    4

  • Number of Terminals:

    324

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA324,18X18,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    3.42 mm

  • Supply Current-Max:

    1127 mA

  • Supply Voltage-Max:

    1.1 V

  • Supply Voltage-Min:

    0.9 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    19 mm

  • uPs/uCs/Peripheral ICs Type:

    BUS CONTROLLER, PCI

89HPES6T6G2ZCALG Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide for the 89HPES6T6G2ZCALG in their application note (R01AN3601EU0100). It suggests using a 4-layer PCB with a thermal pad connected to the ground plane to improve heat dissipation.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating conditions and thermal design guidelines. Additionally, consider using thermal interface materials (TIMs) and heat sinks to reduce the junction temperature.
  • The input capacitor (CIN) should have a minimum capacitance of 10uF and an ESR of ≤ 1Ω. The output capacitor (COUT) should have a minimum capacitance of 22uF and an ESR of ≤ 1Ω. It's also recommended to use X5R or X7R ceramic capacitors for both CIN and COUT.
  • To minimize EMI, follow the recommended PCB layout guidelines, keep the switching node (SW) as small as possible, and use a shielded inductor. Additionally, consider using EMI filters or common-mode chokes to reduce radiated emissions.
  • The bootstrap capacitor (CBST) should have a minimum capacitance of 100nF and a maximum voltage rating of 25V. The bootstrap diode (DBST) should have a fast recovery time (trr) and a maximum voltage rating of 25V. It's recommended to use a Schottky diode for DBST.

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89HPES6T6G2ZCALG Overview

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