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8SLVD1204NLGI8 - Renesas Electronics

Description: The 8SLVD1204 is a high-performance differential LVDS fanout buffer. The device is designed for the fanout of high-frequency, very low additive phase-noise clock and data signals. The 8SLVD1204 is characterized to operate from a 2.5V power supply. Guaranteed output-to-output and part-to-part skew characteristics make the 8SLVD1204 ideal for those clock distribution applications demanding well-defined performance and repeatability. Two selectable differential inputs and four low skew outputs are available. T

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8SLVD1204NLGI8 - Renesas Electronics PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - NLG16P2-ren1
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8SLVD1204NLGI8 - Renesas Electronics  - 3D model - Quad Flat No-Lead - NLG16P2-ren1
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8SLVD1204NLGI8 Details

  • Manufacturer Part Number:

    8SLVD1204NLGI8

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    VFQFPN

  • Pin Count:

    16

  • Manufacturer Package Code:

    NLG16P2

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    15

  • Additional Feature:

    SEATED HT CALCULATED

  • Family:

    8SLVD

  • Input Conditioning:

    DIFFERENTIAL MUX

  • JESD-30 Code:

    S-XQCC-N16

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Logic IC Type:

    LOW SKEW CLOCK DRIVER

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Number of True Outputs:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HQCCN

  • Package Equivalence Code:

    LCC16,.12SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG

  • Peak Reflow Temperature (Cel):

    260

  • Propagation Delay (tpd):

    0.3 ns

  • Same Edge Skew-Max (tskwd):

    0.02 ns

  • Seated Height-Max:

    1.05 mm

  • Supply Voltage-Max (Vsup):

    2.625 V

  • Supply Voltage-Min (Vsup):

    2.375 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

8SLVD1204NLGI8 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the signal traces short and away from noise sources. Use a decoupling capacitor (e.g., 0.1uF) close to the VCC pin.
  • Use a thermal management strategy such as heat sinks, thermal interfaces, or thermal vias to keep the junction temperature below 125°C. Ensure proper airflow and avoid thermal hotspots.
  • Use a metal shield or a conductive enclosure to enclose the device. Ensure good grounding and bonding of the shield to the PCB. Use EMI filters or common-mode chokes on I/O lines if necessary.
  • Ensure that the power supply voltage (VCC) ramps up slowly (e.g., 1-2 ms) to prevent latch-up. Use a power-on reset (POR) circuit or a voltage supervisor to ensure proper startup.
  • Use series termination (e.g., 22-33 ohms) for high-speed signals. Ensure proper signal routing, and use differential signaling where possible. Use a signal integrity analysis tool to optimize the design.

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