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8SLVD1208-33NBGI - Renesas Electronics

Description: The IDT8SLVD1208-33I is a high-performance differential LVDS fanout buffer. The device is designed for the fanout of high-frequency, very low additive phase-noise clock and data signals. The IDT8SLVD1208-33I is characterized to operate from a 3.3V power supply. Guaranteed output-to-output and part-to-part skew characteristics make the IDT8SLVD1208-33I ideal for those clock distribution applications demanding well-defined performance and repeatability. Two selectable differential inputs and eight low skew ou

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8SLVD1208-33NBGI - Renesas Electronics PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - NBG28-
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8SLVD1208-33NBGI - Renesas Electronics  - 3D model - Quad Flat No-Lead - NBG28-
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8SLVD1208-33NBGI Details

  • Manufacturer Part Number:

    8SLVD1208-33NBGI

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    VFQFPN

  • Pin Count:

    28

  • Manufacturer Package Code:

    NBG28

  • Country Of Origin:

    Taiwan, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    26 Weeks, 1 Day

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    15

  • Family:

    8SLVD

  • Input Conditioning:

    DIFFERENTIAL MUX

  • JESD-30 Code:

    S-XQCC-N28

  • Length:

    5 mm

  • Logic IC Type:

    LOW SKEW CLOCK DRIVER

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    28

  • Number of True Outputs:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC28,.2SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TRAY

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    190 mA

  • Prop. Delay@Nom-Sup:

    0.33 ns

  • Propagation Delay (tpd):

    0.33 ns

  • Same Edge Skew-Max (tskwd):

    0.04 ns

  • Seated Height-Max:

    0.8 mm

  • Supply Voltage-Max (Vsup):

    3.465 V

  • Supply Voltage-Min (Vsup):

    3.135 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    5 mm

8SLVD1208-33NBGI Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the signal traces short and away from the power plane to minimize noise and crosstalk.
  • Ensure proper thermal management by providing adequate heat sinking and airflow. Follow the recommended operating conditions and derating guidelines to ensure reliable operation across the entire temperature range.
  • Use a shielded enclosure, keep the device away from antennas and other EMI sources, and use EMI filters or chokes on the power and signal lines. Follow good PCB design practices, such as using a solid ground plane and minimizing loop areas.
  • Follow the recommended power-up and power-down sequences to prevent damage to the device. Ensure that the power supply voltage ramps up and down slowly to prevent inrush currents and voltage spikes.
  • Use a high-quality clock source with low jitter and noise. Route the clock signal traces away from noisy signals and use a clock buffer or repeater to maintain signal integrity.

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8SLVD1208-33NBGI Overview

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