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8SLVD2102NLGI8 - Renesas Electronics

Description: The 8SLVD2102I is a high-performance differential dual 1:2 LVDS fanout buffer. The device is designed for the fanout of high-frequency, very low additive phase-noise clock and data signals. The 8SLVD2102I is characterized to operate from a 2.5V power supply. Guaranteed output-to-output and part-to-part skew characteristics make the 8SLVD2102I ideal for those clock distribution applications demanding well-defined performance and repeatability. Two independent buffers with two low skew outputs each are availa

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8SLVD2102NLGI8 - Renesas Electronics PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - NLG16P2-ren1
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8SLVD2102NLGI8 - Renesas Electronics  - 3D model - Quad Flat No-Lead - NLG16P2-ren1
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8SLVD2102NLGI8 Details

  • Manufacturer Part Number:

    8SLVD2102NLGI8

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    VFQFPN

  • Pin Count:

    16

  • Manufacturer Package Code:

    NLG16P2

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Family:

    8SLVD

  • Input Conditioning:

    DIFFERENTIAL

  • JESD-30 Code:

    S-XQCC-N16

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Logic IC Type:

    LOW SKEW CLOCK DRIVER

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Number of True Outputs:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC16,.12SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    90 mA

  • Prop. Delay@Nom-Sup:

    0.3 ns

  • Propagation Delay (tpd):

    0.3 ns

  • Same Edge Skew-Max (tskwd):

    0.04 ns

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max (Vsup):

    2.625 V

  • Supply Voltage-Min (Vsup):

    2.375 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    3 mm

8SLVD2102NLGI8 Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application notes (e.g., AN1841) and design guides (e.g., DG0023). It's essential to follow these guidelines to ensure optimal performance, minimize noise, and reduce EMI.
  • The 8SLVD2102NLGI8 has a thermal pad on the bottom side, which requires proper thermal management. Use a thermal interface material (TIM) and a heat sink to dissipate heat. Ensure good airflow and follow Renesas' thermal design guidelines (e.g., AN1842) to prevent overheating.
  • The input capacitor (CIN) should be a low-ESR ceramic capacitor (e.g., X5R or X7R) with a value between 4.7 μF to 10 μF. The output capacitor (COUT) should be a low-ESR ceramic capacitor with a value between 10 μF to 22 μF. Refer to Renesas' application notes (e.g., AN1841) for more detailed guidance.
  • Follow Renesas' EMC design guidelines (e.g., AN1843) to minimize electromagnetic interference (EMI). Use proper shielding, grounding, and layout techniques to reduce radiation and susceptibility. Ensure that the device is placed in a shielded area, and use EMI filters or common-mode chokes if necessary.
  • The input voltage (VIN) should be within the recommended range of 2.7 V to 5.5 V. The output voltage (VOUT) should be set using the feedback resistors (RFB1 and RFB2) according to the desired output voltage. Ensure that the output voltage is within the specified range of 0.8 V to 3.3 V.

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