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8T349316NLGI - Renesas Electronics

Description: The 8T349316 is a 2.5V differential clock buffer with sixteen LVDS outputs. The fanout from a differential input to the sixteen LVDS outputs reduces loading on the preceding driver and provides an efficient clock distribution network. The 8T349316 can act as a translator from a differential HSTL, LVPECL, CML or LVDS input to LVDS output signals. A single-ended 3.3V, 2.5V LVCMOS/LVTTL input can also be used to translate to LVDS outputs. The redundant input capability allows for an asynchronous change-over fr

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8T349316NLGI - Renesas Electronics PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - 8T349316NLGI
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8T349316NLGI - Renesas Electronics  - 3D model - Quad Flat No-Lead - 8T349316NLGI
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8T349316NLGI Details

  • Manufacturer Part Number:

    8T349316NLGI

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    VFQFPN

  • Package Description:

    LCC-52

  • Pin Count:

    52

  • Manufacturer Package Code:

    NLG52P1

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Family:

    8T

  • Input Conditioning:

    DIFFERENTIAL MUX

  • JESD-30 Code:

    S-XQCC-N52

  • JESD-609 Code:

    e3

  • Length:

    8 mm

  • Logic IC Type:

    LOW SKEW CLOCK DRIVER

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    52

  • Number of True Outputs:

    32

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC52,.31SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TRAY

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    360 mA

  • Prop. Delay@Nom-Sup:

    1.75 ns

  • Propagation Delay (tpd):

    1.75 ns

  • Same Edge Skew-Max (tskwd):

    0.05 ns

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max (Vsup):

    2.7 V

  • Supply Voltage-Min (Vsup):

    2.3 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    8 mm

  • fmax-Min:

    1000 MHz

8T349316NLGI Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application note (APN) documents, which includes guidelines for thermal vias, copper pours, and component placement to ensure optimal thermal performance.
  • Renesas recommends using an external power sequencer or a dedicated power management IC to ensure proper power sequencing. The datasheet provides guidelines for power-up and power-down sequences, but a detailed implementation example can be found in the application notes or through direct support from Renesas.
  • Renesas recommends using high-quality, low-ESR decoupling capacitors with a value of 10uF to 22uF, placed as close as possible to the device's power pins. The datasheet provides a recommended decoupling capacitor layout, but the specific capacitor values and types may vary depending on the application.
  • Renesas provides a clock signal troubleshooting guide in their application notes, which includes steps to verify the clock signal frequency, amplitude, and jitter. Additionally, Renesas support teams can provide further assistance with clock signal-related issues.
  • Renesas recommends considering thermal design factors such as junction-to-case thermal resistance, thermal interface material, and heat sink design. The datasheet provides thermal design guidelines, and Renesas application notes offer more detailed information on thermal design considerations.

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