A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the signal traces short and away from the power plane to minimize noise and EMI.
Use a heat sink with a thermal conductivity of at least 1 W/m-K and ensure good airflow around the device. Also, consider derating the device's power consumption according to the temperature derating curve in the datasheet.
Use a reflow soldering profile with a peak temperature of 240°C and a dwell time of 30-60 seconds. Avoid exceeding 260°C to prevent damage to the component.
Check the input voltage, output load, and feedback resistors for correct values and connections. Verify that the device is properly decoupled and that the output capacitor is of sufficient value and type.
Yes, use a common-mode choke and a differential-mode filter capacitor to reduce EMI emissions. Ensure the filter components are placed close to the device and connected to a solid ground plane.
Trust Checks
No trust score is available for this model.
Trust Score Unavailable
Sponsored
930176100 Overview
Use the download button to access the 930176100 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like 93017,
or try a keyword search, such as Other Interconnects
