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98997-1002 - Molex

Description: Automotive Connectors CMC HEADER W/ PIN TERM RA T4 BLK 53P

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PCB Footprints
98997-1002 - Molex PCB footprint - Other - Other - 98997-1002_1
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3D Models
98997-1002 - Molex  - 3D model - Other - 98997-1002_1
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98997-1002 Details

  • Manufacturer Part Number:

    98997-1002

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • ECCN Code:

    EAR99

  • HTS Code:

    8536.69.40.30

  • Manufacturer:

    Molex

  • YTEOL:

    0

  • Connector Type:

    COMBINATION LINE CONNECTOR

  • Contact Gender:

    FEMALE

  • Empty Shell:

    NO

  • Filter Feature:

    NO

  • Insulator Material:

    GLASS FILLED POLYBUTYLENE TEREPHTHALATE

  • Mating Information:

    MULTIPLE MATING PARTS AVAILABLE

  • Mixed Contacts:

    NO

  • Mounting Type:

    BOARD

  • Number of Rows Loaded:

    4

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Option:

    GENERAL PURPOSE

  • Rated Current (Signal):

    12 A

  • Termination Type:

    SOLDER

  • Total Number of Contacts:

    53

98997-1002 Frequently Asked Questions (FAQs)

  • The recommended torque specification is 0.5-1.5 Nm (4.4-13.4 in-lbs) for the screws on the 98997-1002 connector.
  • Yes, the 98997-1002 connector is designed to support high-speed signals up to 10 Gbps and is suitable for high-frequency applications.
  • The operating temperature range for the 98997-1002 connector is -40°C to 105°C (-40°F to 221°F).
  • Yes, the 98997-1002 connector is designed to withstand harsh environments, including exposure to moisture, vibration, and mechanical shock.
  • The mating cycle life of the 98997-1002 connector is rated for a minimum of 500 mating cycles.

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98997-1002 Overview

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About Molex

Molex is a global manufacturer of connectivity solutions for various industries. The company offers a wide range of products including connectors, cables, antennas, sensors, and integrated systems. Molex's products are used in diverse applications such as automotive, telecommunications, data centers, consumer electronics, industrial automation, medical devices, and aerospace.

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