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9DB403DFLFT - Renesas Electronics

Description: The 9DB403 is compatible with the Intel DB400v2 Differential Buffer Specification. This buffer provides 4 PCI Express® Gen2 clocks. The 9DB403 is driven by a differential output pair from a CK410B+, CK505 or CK509B main clock generator.

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9DB403DFLFT - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - SSOP28
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9DB403DFLFT Details

  • Manufacturer Part Number:

    9DB403DFLFT

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SSOP

  • Pin Count:

    28

  • Manufacturer Package Code:

    PYG28

  • Country Of Origin:

    Malaysia

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    7

  • Family:

    9DB

  • Input Conditioning:

    DIFFERENTIAL MUX

  • JESD-30 Code:

    R-PDSO-G28

  • JESD-609 Code:

    e3

  • Length:

    10.2 mm

  • Logic IC Type:

    PLL BASED CLOCK DRIVER

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    28

  • Number of True Outputs:

    4

  • Operating Temperature-Max:

    70 °C

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Equivalence Code:

    SSOP28,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Same Edge Skew-Max (tskwd):

    0.05 ns

  • Seated Height-Max:

    2 mm

  • Supply Voltage-Max (Vsup):

    3.465 V

  • Supply Voltage-Min (Vsup):

    3.135 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    5.3 mm

9DB403DFLFT Frequently Asked Questions (FAQs)

  • Renesas recommends a 4-layer PCB with a solid ground plane and thermal vias to dissipate heat efficiently. A minimum of 2 oz copper thickness is recommended for the power planes.
  • Renesas recommends using a thermal interface material (TIM) with a thermal conductivity of at least 1 W/m-K between the device and the heat sink. Ensure the heat sink is properly attached and the system is designed to operate within the specified temperature range.
  • Renesas recommends using 10-22 uF decoupling capacitors with an ESR of less than 1 ohm, placed as close as possible to the device's power pins. Use a capacitor with a voltage rating of at least 2x the maximum operating voltage.
  • Renesas recommends using a human body model (HBM) ESD protection circuit with a minimum of 2 kV rating. Ensure the ESD protection circuit is placed close to the device's input pins and connected to a solid ground plane.
  • Renesas recommends setting the internal regulators to their default values unless specific application requirements dictate otherwise. Refer to the datasheet for default values and adjustment procedures.

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9DB403DFLFT Overview

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