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9DB403DGLF - Renesas Electronics

Description: The 9DB403 is compatible with the Intel DB400v2 Differential Buffer Specification. This buffer provides 4 PCI Express® Gen2 clocks. The 9DB403 is driven by a differential output pair from a CK410B+, CK505 or CK509B main clock generator.

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9DB403DGLF - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - TSSOP_28
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9DB403DGLF Details

  • Manufacturer Part Number:

    9DB403DGLF

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Pin Count:

    28

  • Manufacturer Package Code:

    PGG28

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    7

  • Family:

    9DB

  • Input Conditioning:

    DIFFERENTIAL MUX

  • JESD-30 Code:

    R-PDSO-G28

  • JESD-609 Code:

    e3

  • Length:

    9.7 mm

  • Logic IC Type:

    PLL BASED CLOCK DRIVER

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    28

  • Number of True Outputs:

    4

  • Operating Temperature-Max:

    70 °C

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP28,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Same Edge Skew-Max (tskwd):

    0.05 ns

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max (Vsup):

    3.465 V

  • Supply Voltage-Min (Vsup):

    3.135 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

9DB403DGLF Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application note (APL-AN-1201) for thermal management. It suggests using a 4-layer PCB with a thermal relief pattern, and placing the device near a thermal pad or heat sink.
  • Renesas recommends following their thermal design guidelines, using a heat sink or thermal pad, and ensuring good airflow around the device. Additionally, consider using a thermal interface material (TIM) to improve heat transfer.
  • Renesas recommends using a low-ESR ceramic capacitor (e.g., X5R or X7R) for CIN, with a value between 4.7uF to 10uF. For COUT, use a low-ESR ceramic or electrolytic capacitor with a value between 10uF to 22uF. Ensure the capacitors meet the specified voltage and ripple current ratings.
  • Renesas suggests following good PCB design practices, such as using a solid ground plane, minimizing trace lengths, and keeping sensitive signals away from the switching node. Additionally, consider using EMI filters or shielding to reduce radiation.
  • Renesas recommends using a low-ESR ceramic capacitor (e.g., X5R or X7R) for CBST, with a value between 100nF to 220nF. For DBST, use a fast-recovery diode (e.g., 1N4148) with a reverse voltage rating greater than the input voltage.

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9DB403DGLF Overview

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