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9DBL0255NLGI8 - Renesas Electronics

Description: The device is a 2-output PCIe clock fanout buffers for PCIe Gen1–5 applications. It has an open drain Loss of Signal (LOS) output to indicate the absence or presence of an input clock. For information regarding evaluation boards and material, please contact your local sales representative.

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PCB Footprints
9DBL0255NLGI8 - Renesas Electronics PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - 16-VFQFPN 3.0 x 3.0 x 0.9 mm Body, 0.50mm Pitch
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3D Models
9DBL0255NLGI8 - Renesas Electronics  - 3D model - Quad Flat No-Lead - 16-VFQFPN 3.0 x 3.0 x 0.9 mm Body, 0.50mm Pitch
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9DBL0255NLGI8 Details

  • Manufacturer Part Number:

    9DBL0255NLGI8

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    VFQFPN

  • Pin Count:

    16

  • Manufacturer Package Code:

    NLG16P3

  • Country Of Origin:

    Malaysia

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    7

  • Additional Feature:

    SEATED HGT NOM

  • Family:

    9DBL

  • Input Conditioning:

    DIFFERENTIAL

  • JESD-30 Code:

    S-XQCC-N16

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Logic IC Type:

    LOW SKEW CLOCK DRIVER

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Number of True Outputs:

    4

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE WITH SERIES RESISTOR

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC16,.11SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    36 mA

  • Propagation Delay (tpd):

    4.9 ns

  • Same Edge Skew-Max (tskwd):

    0.015 ns

  • Seated Height-Max:

    0.903 mm

  • Supply Voltage-Max (Vsup):

    3.465 V

  • Supply Voltage-Min (Vsup):

    3.135 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    3 mm

9DBL0255NLGI8 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. The device should be placed near the center of the board, and decoupling capacitors should be placed close to the device.
  • Ensure proper heat sinking, use a thermal interface material, and follow the recommended thermal design guidelines. Also, consider using a thermal sensor to monitor the device temperature.
  • The input clock signal should be a stable, low-jitter signal with a frequency range of 10-133 MHz. The signal should be AC-coupled and have a voltage swing of 0.5-1.5 V.
  • Use a logic analyzer or oscilloscope to monitor the device's input and output signals. Check the power supply voltage, clock signal, and reset signal. Consult the datasheet and application notes for troubleshooting guidelines.
  • The power supply voltage should be a stable, low-noise voltage within the range of 1.71-1.89 V. A decoupling capacitor of at least 0.1 uF should be placed close to the device.

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