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9ZXL0651AKLF - Renesas Electronics

Description: The 9ZXL0651 is a low-power 6-output differential buffer that meets all the performance requirements of the Intel DB1200Z specification. It consumes 50% less power than standard HCSL devices and has internal terminations to allow direct connection to 85 ohm transmission lines. It is suitable for PCI-Express Gen1/2/3 or QPI/UPI applications, and uses a fixed external feedback to maintain low drift for demanding QPI/UPI applications.

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PCB Footprints
9ZXL0651AKLF - Renesas Electronics PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - NDG40P2-1
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9ZXL0651AKLF - Renesas Electronics  - 3D model - Quad Flat No-Lead - NDG40P2-1
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9ZXL0651AKLF Details

  • Manufacturer Part Number:

    9ZXL0651AKLF

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    VFQFPN

  • Package Description:

    LCC-40

  • Pin Count:

    40

  • Manufacturer Package Code:

    NDG40P2

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    7

  • Family:

    9ZXL

  • Input Conditioning:

    DIFFERENTIAL MUX

  • JESD-30 Code:

    S-XQCC-N40

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Load Capacitance (CL):

    2 pF

  • Logic IC Type:

    PLL BASED CLOCK DRIVER

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    40

  • Number of True Outputs:

    12

  • Operating Temperature-Max:

    70 °C

  • Output Characteristics:

    3-STATE WITH SERIES RESISTOR

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC40,.2SQ,16

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TRAY

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    50 mA

  • Prop. Delay@Nom-Sup:

    4.5 ns

  • Propagation Delay (tpd):

    4.5 ns

  • Same Edge Skew-Max (tskwd):

    0.065 ns

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max (Vsup):

    3.465 V

  • Supply Voltage-Min (Vsup):

    3.135 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    QUAD

  • Width:

    5 mm

  • fmax-Min:

    0.1 MHz

9ZXL0651AKLF Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application notes (e.g., AN98374) and design guides (e.g., RL78/G14 Group PCB Layout Guide). It's essential to follow these guidelines to ensure optimal performance, reduce noise, and prevent electromagnetic interference (EMI).
  • The 9ZXL0651AKLF has a built-in POR and BOD circuit. To implement POR, connect the VCC pin to a power source, and the device will automatically reset when the voltage reaches the POR threshold. For BOD, set the BODEN bit in the SYSCR register to enable brown-out detection. The device will reset when the voltage drops below the BOD threshold.
  • The maximum clock frequency for the 9ZXL0651AKLF is 32 MHz. However, the actual clock frequency may be limited by the specific application, operating voltage, and temperature range. Always check the datasheet and application notes for specific guidance on clock frequency selection.
  • The WDT can be configured using the WDTCSR register. Set the WDTS bit to enable the WDT, and configure the WDT timeout period using the WDTPS bits. The WDT can be reset using the WDT reset signal or by writing to the WDTCSR register.
  • The 9ZXL0651AKLF has a maximum junction temperature (TJ) of 150°C. Ensure proper thermal management by providing adequate heat dissipation, using thermal vias, and following Renesas' thermal design guidelines. Also, consider using a thermal interface material (TIM) to improve heat transfer between the device and the PCB.

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