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A4940KLPTR-T - Allegro Microsystems

Description: Automotive Full Bridge MOSFET Driver

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PCB Footprints
A4940KLPTR-T - Allegro Microsystems PCB footprint - Other - Other - LP Package, 24-Pin TSSOP
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3D Models
A4940KLPTR-T - Allegro Microsystems  - 3D model - Other - LP Package, 24-Pin TSSOP
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A4940KLPTR-T Details

  • Manufacturer Part Number:

    A4940KLPTR-T

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TSSOP

  • Package Description:

    TSSOP-24

  • Pin Count:

    24

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Allegro MicroSystems LLC

  • YTEOL:

    0

  • High Side Driver:

    YES

  • Interface IC Type:

    FULL BRIDGE BASED MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G24

  • JESD-609 Code:

    e3

  • Length:

    7.8 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    24

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Equivalence Code:

    TSSOP24,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max:

    50 V

  • Supply Voltage-Min:

    5.5 V

  • Supply Voltage-Nom:

    12 V

  • Supply Voltage1-Max:

    50 V

  • Supply Voltage1-Min:

    5.5 V

  • Supply Voltage1-Nom:

    12 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Turn-off Time:

    0.15 µs

  • Turn-on Time:

    0.15 µs

  • Width:

    4.4 mm

A4940KLPTR-T Frequently Asked Questions (FAQs)

  • A good thermal design should be used to ensure the device operates within the recommended temperature range. A minimum of 2 oz copper thickness is recommended, and thermal vias should be used to dissipate heat. The device should be placed on a solid copper plane, and the PCB should have a good thermal conductivity.
  • The device should be powered from a stable, low-noise power supply. A 10 μF ceramic capacitor should be placed as close as possible to the device's power pins, and a 1 μF ceramic capacitor should be placed near the device's analog power pins. Additionally, a 10 nF capacitor should be placed between the device's power pins and ground.
  • The device should be soldered using a reflow soldering process with a peak temperature of 260°C. The device should be placed on a solder paste layer with a thickness of 0.1 mm to 0.2 mm. The soldering process should be done in a nitrogen atmosphere to prevent oxidation.
  • To troubleshoot issues with the device's output current, check the input voltage, output voltage, and output current using an oscilloscope or a multimeter. Verify that the device is properly powered and decoupled. Check for any short circuits or open circuits on the PCB. If the issue persists, consult the datasheet and application notes for further guidance.
  • The device should be stored in a dry, cool place away from direct sunlight. The device should be handled with anti-static wrist straps or mats to prevent electrostatic discharge. The device should not be exposed to temperatures above 150°C or below -40°C.

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A4940KLPTR-T Overview

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