The recommended land pattern for AC0805FR-1310RL is a rectangular pad with a size of 1.2mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape. The land pattern should be designed to accommodate the component's termination style and ensure reliable soldering.
Yes, AC0805FR-1310RL is rated for operation up to 150°C, making it suitable for high-temperature applications. However, it's essential to ensure that the component is properly derated and that the operating conditions do not exceed the recommended specifications.
Yes, AC0805FR-1310RL is compatible with lead-free soldering processes. The component is designed to meet the requirements of RoHS and REACH directives, and it can be soldered using lead-free solder alloys such as SAC305 or Sn96.5Ag3Cu0.5.
The MSL of AC0805FR-1310RL is 1, which means that the component can be exposed to a maximum of 30°C/60%RH for 192 hours before soldering. It's essential to follow proper storage and handling procedures to prevent moisture absorption and ensure reliable soldering.
Yes, AC0805FR-1310RL is designed for high-reliability and long-term stability applications. The component has undergone rigorous testing and qualification to ensure that it meets the requirements of automotive, industrial, and other demanding applications.
Trust Checks
This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored
AC0805FR-1310RL Overview
Use the download button to access the AC0805FR-1310RL schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like AC080,
or try a keyword search, such as Metal Glaze/Thick Film Resistors
