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ACASN2002S2002P1AT - Vishay

Description: Precision Thin Film Chip Resistor Array Superior Moisture Resistivity

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PCB Footprints
ACASN2002S2002P1AT - Vishay PCB footprint - Other - Other - ACASN1000E1000P1AT
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3D Models
ACASN2002S2002P1AT - Vishay  - 3D model - Other - ACASN1000E1000P1AT
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ACASN2002S2002P1AT Details

  • Manufacturer Part Number:

    ACASN2002S2002P1AT

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Germany

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.20

  • Factory Lead Time:

    9 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    8

  • Additional Feature:

    ANTI-SULFUR, PRECISION, RATED AC VOLTAGE(V): 100

  • Construction:

    Rectangular

  • Element Power Dissipation:

    0.1 W

  • First Element Resistance:

    20000 Ω

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Network Type:

    ISOLATED

  • Number of Elements:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.45 mm

  • Package Length:

    1.6 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    1.5 mm

  • Packing Method:

    TR, Paper, 7 Inch

  • Rated Power Dissipation (P):

    0.15 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200

  • Resistance:

    20000 Ω

  • Resistor Type:

    ARRAY/NETWORK RESISTOR

  • Second/Last Element Resistance:

    20000 Ω

  • Size Code:

    0606

  • Surface Mount:

    YES

  • Technology:

    THIN FILM

  • Temperature Coefficient:

    25 ppm/°C

  • Temperature Coefficient Tracking:

    15 ppm/°C

  • Terminal Finish:

    Matte Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    0.1%

  • Working Voltage:

    100 V

ACASN2002S2002P1AT Frequently Asked Questions (FAQs)

  • For optimal thermal performance, it's recommended to use a PCB layout with a large copper area connected to the thermal pad, and to use thermal vias to dissipate heat efficiently.
  • To ensure reliable soldering, use a soldering iron with a temperature range of 250°C to 260°C, and apply a small amount of solder paste to the pads. Avoid applying excessive pressure or heat, which can damage the component.
  • The maximum allowed voltage derating for the ACASN2002S2002P1AT is 80% of the rated voltage, as specified in the datasheet. Exceeding this derating may reduce the component's lifespan or cause premature failure.
  • While the ACASN2002S2002P1AT is designed for high-frequency applications, its performance may degrade above 1 GHz. For frequencies above 1 GHz, consider using a more specialized component or consulting with a Vishay Intertechnologies application engineer.
  • To prevent electrostatic discharge (ESD) damage, handle the ACASN2002S2002P1AT with ESD-protective equipment, such as wrist straps or mats, and avoid touching the component's pins or pads. Store the component in its original packaging or an ESD-protective bag when not in use.

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