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ACS37220LEZATR-200B5 - Allegro Microsystems

Description: Board Mount Current Sensors High Power Density 200A, 5V Current Sensor in QFN Package

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ACS37220LEZATR-200B5 Details

  • Manufacturer Part Number:

    ACS37220LEZATR-200B5

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Manufacturer:

    Allegro MicroSystems LLC

  • Body Breadth:

    4 mm

  • Body Height:

    1.425 mm

  • Body Length or Diameter:

    4 mm

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    7

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    ANALOG

  • Output Type:

    ANALOG VOLTAGE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape/Style:

    SQUARE

  • Screening Level:

    AEC-Q100

  • Sensors/Transducers Type:

    CURRENT SENSOR

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    4.5 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

ACS37220LEZATR-200B5 Frequently Asked Questions (FAQs)

  • Allegro provides a recommended PCB layout in their application note AN296068, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and accuracy.
  • Calibration involves adjusting the sensitivity and offset of the device to match the specific requirements of your application. Allegro provides a calibration procedure in their datasheet, which involves applying a known current to the device and adjusting the sensitivity and offset registers accordingly.
  • The maximum allowable voltage on the VCC pin is 5.5V, as specified in the datasheet. Exceeding this voltage may damage the device.
  • The ACS37220LEZATR-200B5 is rated for operation up to 150°C, but its accuracy and performance may degrade at high temperatures. Allegro provides thermal derating curves in their datasheet to help designers estimate the device's performance at elevated temperatures.
  • Allegro recommends using proper PCB layout and shielding techniques, such as using a ground plane and shielding the device with a metal can or shield, to minimize EMI. Additionally, designers should ensure that the device is properly decoupled and filtered to prevent EMI from affecting its performance.

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ACS37220LEZATR-200B5 Overview

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