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ACST6-7ST - STMicroelectronics

Description: Overvoltage protected AC switch

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ACST6-7ST - STMicroelectronics PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-220AB/2022-2--
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ACST6-7ST - STMicroelectronics  - 3D model - Transistor Outline, Vertical - TO-220AB/2022-2--
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ACST6-7ST Details

  • Manufacturer Part Number:

    ACST6-7ST

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TO-220AB

  • Package Description:

    PLASTIC PACKAGE-3

  • Pin Count:

    3

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.30.00.80

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    0

  • Case Connection:

    MAIN TERMINAL 2

  • Configuration:

    SINGLE

  • Critical Rate of Rise of Off-State Voltage-Min:

    200 V/us

  • DC Gate Trigger Current-Max:

    10 mA

  • DC Gate Trigger Voltage-Max:

    1.5 V

  • Holding Current-Max:

    25 mA

  • JEDEC-95 Code:

    TO-220AB

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Leakage Current-Max:

    0.5 mA

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -30 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Qualification Status:

    Not Qualified

  • RMS On-state Current-Max:

    6 A

  • Repetitive Peak Off-state Voltage:

    700 V

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Trigger Device Type:

    SNUBBERLESS TRIAC

ACST6-7ST Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias under the package can help to dissipate heat efficiently. Ensure a minimum of 1mm clearance around the package for airflow.
  • Implement a thermal management strategy, such as heat sinks, thermal interfaces, or fans, to keep the junction temperature below 150°C. Monitor the device's thermal status using the thermal monitoring pin (THERM).
  • Use 10nF to 100nF ceramic capacitors, placed as close as possible to the device's power pins, to filter out high-frequency noise and ensure stable operation.
  • Implement ESD protection circuits, such as TVS diodes or ESD arrays, on the input lines to protect the device from electrostatic discharge events.
  • Power up the device in the following sequence: VCC, then VDD, and finally the input signals. Ensure a monotonic power-up sequence to prevent latch-up or damage.

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ACST6-7ST Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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