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AD3552RBCPZ16 - Analog Devices

Description: Dual Channel, 16-Bit, 33 MUPS, Multispan, Multi-IO SPI DAC

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PCB Footprints
AD3552RBCPZ16 - Analog Devices PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - CP-32-30
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3D Models
AD3552RBCPZ16 - Analog Devices  - 3D model - Quad Flat No-Lead - CP-32-30
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AD3552RBCPZ16 Details

  • Manufacturer Part Number:

    AD3552RBCPZ16

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LFCSP-32

  • Pin Count:

    32

  • Manufacturer Package Code:

    CP-32-30

  • HTS Code:

    8542.39.00.40

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    8.5

  • Converter Type:

    DAC 16BIT

  • Input Bit Code:

    BINARY

  • Input Format:

    SERIAL

  • JESD-30 Code:

    S-XQCC-N32

  • Length:

    5 mm

  • Linearity Error-Max (EL):

    0.006103516%

  • Moisture Sensitivity Level:

    3

  • Number of Bits:

    16

  • Number of Functions:

    1

  • Number of Terminals:

    32

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC32,.2SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Seated Height-Max:

    1 mm

  • Settling Time-Nom (tstl):

    0.1 µs

  • Supply Current-Max:

    28.5 mA

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    5 mm

AD3552RBCPZ16 Frequently Asked Questions (FAQs)

  • A good PCB layout for the AD3552RBCPZ16 involves keeping the analog and digital grounds separate, using a solid ground plane, and minimizing noise coupling between the analog and digital sections. A 4-layer PCB with a dedicated analog ground plane and a dedicated digital ground plane is recommended. Additionally, the device's exposed pad should be connected to the analog ground plane.
  • The AD3552RBCPZ16 requires a calibration procedure to ensure accurate measurements. This involves applying a known input voltage and adjusting the internal calibration registers to achieve the desired accuracy. The calibration procedure is described in the device's datasheet and should be performed after power-up and after any changes to the device's configuration.
  • The maximum sampling rate of the AD3552RBCPZ16 is 250 kSPS. The sampling rate affects the device's power consumption, with higher sampling rates resulting in higher power consumption. The device's power consumption can be reduced by lowering the sampling rate, but this may also affect the accuracy of the measurements.
  • The AD3552RBCPZ16 has built-in overvoltage and undervoltage protection. If the input voltage exceeds the maximum rating, the device will enter a high-impedance state to protect itself from damage. Similarly, if the input voltage falls below the minimum rating, the device will enter a low-power state to conserve power. The device will automatically recover from these conditions when the input voltage returns to a safe range.
  • The AD3552RBCPZ16 is rated for operation up to 125°C, but its accuracy and performance may degrade at high temperatures. The device's offset voltage and gain error may increase with temperature, affecting the accuracy of the measurements. Additionally, the device's power consumption may increase at high temperatures, which can affect the overall system design.

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AD3552RBCPZ16 Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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