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AD45335KBCZ - Analog Devices

Description: 32-Channel, 14-Bit DAC with Full-Scale Output Voltage Programmable from 50 V to 200 V

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AD45335KBCZ - Analog Devices PCB footprint - BGA - BGA - 124-Lead Chip Scale Package Ball Grid Array [CSP_BGA]-
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3D Models
AD45335KBCZ - Analog Devices  - 3D model - BGA - 124-Lead Chip Scale Package Ball Grid Array [CSP_BGA]-
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AD45335KBCZ Details

  • Manufacturer Part Number:

    AD45335KBCZ

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    CHIP SCALE BGA

  • Package Description:

    CSPBGA-196/124

  • Pin Count:

    124

  • Manufacturer Package Code:

    CHIP SCALE BGA

  • HTS Code:

    8542.39.00.40

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    8.5

  • Analog Output Voltage-Max:

    222.5 V

  • Analog Output Voltage-Min:

    1 V

  • Converter Type:

    D/A CONVERTER

  • Input Bit Code:

    BINARY

  • Input Format:

    SERIAL

  • JESD-30 Code:

    S-XBCS-B124

  • Length:

    15 mm

  • Linearity Error-Max (EL):

    0.00061035%

  • Moisture Sensitivity Level:

    3

  • Number of Bits:

    14

  • Number of Functions:

    1

  • Number of Terminals:

    124

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -10 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    BCS

  • Package Equivalence Code:

    BGA124,14X14,40

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP SCALE

  • Seated Height-Max:

    1.4 mm

  • Settling Time-Nom (tstl):

    470 µs

  • Supply Current-Max:

    20 mA

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    15 mm

AD45335KBCZ Frequently Asked Questions (FAQs)

  • It is recommended to follow a star-grounding layout, keeping the analog and digital grounds separate, and placing the device close to the analog signal sources. Additionally, ensure that the device is placed away from high-frequency noise sources and digital signals.
  • Consult the datasheet and application notes for guidance on configuring the device. Consider factors like input signal amplitude, desired output voltage range, and required bandwidth. Use the device's internal gain settings and external resistors to achieve the desired configuration.
  • The device has a maximum junction temperature of 150°C. Ensure good thermal conductivity by using a heat sink or thermal pad, and follow proper PCB design guidelines for thermal management. Operate the device within the recommended temperature range to ensure reliability.
  • Consult the datasheet and application notes for troubleshooting guidelines. Check for proper power supply connections, ensure correct configuration and gain settings, and verify that the input signals are within the recommended range. Use oscilloscopes or other diagnostic tools to identify and isolate issues.
  • Follow proper PCB design guidelines for EMI and RFI mitigation, such as using shielding, grounding, and decoupling techniques. Ensure that the device is placed in a shielded area, and use EMI filters or chokes to reduce noise. Consult the datasheet and application notes for specific guidance on EMI and RFI considerations.

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AD45335KBCZ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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