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AD5259BCPZ50-R7 - Analog Devices

Description: Nonvolatile, I2C Compatible 256-Position, Digital Potentiometer

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AD5259BCPZ50-R7 - Analog Devices PCB footprint - Small Outline No-lead - Small Outline No-lead - 10-Lead Lead Frame Chip Scale Package [LFCSP] 3 x 3 mm Body and 0.75 mm Package Height
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3D Models
AD5259BCPZ50-R7 - Analog Devices  - 3D model - Small Outline No-lead - 10-Lead Lead Frame Chip Scale Package [LFCSP] 3 x 3 mm Body and 0.75 mm Package Height
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AD5259BCPZ50-R7 Details

  • Manufacturer Part Number:

    AD5259BCPZ50-R7

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    3 X 3 MM, 0.80 MM HEIGHT, LEAD FREE, LFCSP-10

  • Pin Count:

    10

  • Manufacturer Package Code:

    CP-10-9

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Additional Feature:

    NONVOLATILE MEMORY; IT CAN ALSO OPERATE FROM A 5V NOMINAL SUPPLY

  • Bandwidth-Nom:

    0.16 kHz

  • Control Interface:

    2-WIRE SERIAL

  • Converter Type:

    DIGITAL POTENTIOMETER

  • JESD-30 Code:

    S-XDSO-N10

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Positions:

    256

  • Number of Terminals:

    10

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC10,.12,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Resistance Law:

    LINEAR

  • Resistance Tolerance-Max:

    30%

  • Resistor Terminal Voltage-Max:

    3 V

  • Seated Height-Max:

    0.8 mm

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Temperature Coefficient-Nom:

    60 ppm/°C

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Total Resistance-Nom:

    50000 Ω

  • Width:

    3 mm

AD5259BCPZ50-R7 Frequently Asked Questions (FAQs)

  • The recommended power-up sequence is to apply VDD first, followed by VLOGIC, and then the digital inputs. This ensures proper device operation and prevents latch-up.
  • To ensure accurate resistance settings, it's essential to follow the recommended digital input sequence, use a stable clock signal, and minimize noise on the digital inputs. Additionally, consider using a capacitor on the RFB pin to filter out noise and improve accuracy.
  • The maximum operating frequency of the AD5259 is 50 MHz. However, the actual operating frequency may be limited by the specific application and system design.
  • The AD5259 is rated for operation up to 125°C. However, the device's performance and accuracy may degrade at higher temperatures. It's essential to consult the datasheet and perform thorough testing to ensure the device meets the required specifications in the target application.
  • The AD5259 can be interfaced with a microcontroller using a standard SPI interface. The microcontroller should provide a clock signal, chip select signal, and data signals to the AD5259. The specific interface details may vary depending on the microcontroller and system design.

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AD5259BCPZ50-R7 Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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