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AD5316RBCPZ-RL7 - Analog Devices

Description: Digital to Analog Converters - DAC IC 10bit 4ch 12C w/on chip ref

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PCB Footprints
AD5316RBCPZ-RL7 - Analog Devices PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - 16-Lead Lead Frame Chip Scale Package [LFCSP] 3 mm × 3 mm Body, Very Very Thin Quad (CP-16-22)
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3D Models
AD5316RBCPZ-RL7 - Analog Devices  - 3D model - Quad Flat No-Lead - 16-Lead Lead Frame Chip Scale Package [LFCSP] 3 mm × 3 mm Body, Very Very Thin Quad (CP-16-22)
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AD5316RBCPZ-RL7 Details

  • Manufacturer Part Number:

    AD5316RBCPZ-RL7

  • Source Url Status Check Date:

    2013-05-01 14:56:11.966

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LFCSP-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    CP-16-22

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Analog Output Voltage-Max:

    5.005 V

  • Converter Type:

    D/A CONVERTER

  • Input Bit Code:

    BINARY

  • Input Format:

    SERIAL

  • JESD-30 Code:

    S-XQCC-N16

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Linearity Error-Max (EL):

    0.0488%

  • Moisture Sensitivity Level:

    3

  • Number of Bits:

    10

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC16,.12SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.8 mm

  • Settling Time-Max:

    7 µs

  • Settling Time-Nom (tstl):

    5 µs

  • Supply Current-Max:

    1.3 mA

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

AD5316RBCPZ-RL7 Frequently Asked Questions (FAQs)

  • A good PCB layout for the AD5316RBCPZ-RL7 involves keeping the analog and digital grounds separate, using a solid ground plane, and minimizing noise coupling between the analog and digital sections. A 4-layer PCB with a dedicated analog ground plane is recommended.
  • To ensure accurate voltage reference performance, it's essential to decouple the VREF pin with a 10nF capacitor to GND, and use a low-impedance voltage source for the VCC pin. Additionally, keep the voltage reference input pin (VIN) away from noisy digital signals.
  • The recommended power-up sequence is to apply VCC first, followed by the voltage reference input (VIN). This ensures that the internal voltage regulator is powered up before the voltage reference circuitry.
  • To minimize noise and interference, use a low-pass filter on the voltage reference input (VIN), keep the AD5316RBCPZ-RL7 away from noisy digital signals, and use shielding or guard rings to prevent electromagnetic interference.
  • The thermal impedance of the AD5316RBCPZ-RL7 package is typically around 30°C/W. This means that for every watt of power dissipated, the junction temperature will rise by 30°C above the ambient temperature.

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AD5316RBCPZ-RL7 Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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