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AD5423BCPZ-RL7 - Analog Devices

Description: Digital to Analog Converters - DAC 1 Channel 16-Bit 4to20 mA

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AD5423BCPZ-RL7 - Analog Devices - PCB symbol
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AD5423BCPZ-RL7 - Analog Devices PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - lfcsp
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AD5423BCPZ-RL7 - Analog Devices - 3D model - Quad Flat No-Lead - lfcsp
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AD5423BCPZ-RL7 Details

  • Manufacturer Part Number:

    AD5423BCPZ-RL7

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    32

  • Manufacturer Package Code:

    CP-32-12

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Date Of Intro:

    2019-07-12

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Analog Output Voltage-Max:

    10 V

  • Analog Output Voltage-Min:

    -10 V

  • Converter Type:

    D/A CONVERTER

  • Input Bit Code:

    BINARY

  • Input Format:

    SERIAL

  • JESD-30 Code:

    S-XQCC-N32

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Linearity Error-Max (EL):

    0.006%

  • Moisture Sensitivity Level:

    3

  • Negative Supply Voltage-Nom:

    -15 V

  • Number of Bits:

    16

  • Number of Functions:

    1

  • Number of Terminals:

    32

  • Operating Temperature-Max:

    115 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.8 mm

  • Settling Time-Nom (tstl):

    20 µs

  • Supply Voltage-Nom:

    15 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    5 mm

AD5423BCPZ-RL7 Frequently Asked Questions (FAQs)

  • A good layout and routing practice is to keep the analog and digital grounds separate, use a solid ground plane, and keep the input and output traces short and away from noise sources. Additionally, use a low-ESR capacitor for the AVDD and DVDD pins, and decouple the VREF pin with a 10uF capacitor.
  • To ensure accuracy, use a high-precision voltage reference, such as the ADR421 or ADR4525, and ensure that the input voltage is within the specified range. Also, use a low-noise, low-temperature-coefficient resistor for the feedback resistor (RFB) and a high-precision capacitor for the compensation capacitor (CCOMP).
  • The recommended power-up sequence is to power up the AVDD pin first, followed by the DVDD pin, and then the input voltage (VIN). This ensures that the internal biasing and voltage references are established before the input voltage is applied.
  • The thermal shutdown feature is designed to protect the device from overheating. If the device exceeds the maximum junction temperature (TJ), it will shut down. To handle this, ensure good thermal design practices, such as using a heat sink or thermal pad, and monitor the device temperature using the THERM pin.
  • A simple RC filter can be used to filter the output voltage. A 1uF capacitor in series with a 1kΩ resistor is a good starting point. However, the optimal filter values will depend on the specific application and noise requirements.

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AD5423BCPZ-RL7 Overview

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To find more CAD model downloads similar to this part, try a partial part number search, like AD542, or try a keyword search, such as Digital to Analog Converters

About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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