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AD548JRZ-REEL7 - Analog Devices

Description: Operational Amplifiers - Op Amps LOW POWER BIFET OP AMP IC

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AD548JRZ-REEL7 - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - SOIC (R) Package
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AD548JRZ-REEL7 Details

  • Manufacturer Part Number:

    AD548JRZ-REEL7

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Part Package Code:

    SOIC

  • Package Description:

    SOIC-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    R-8

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    3

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.00002 µA

  • Bias Current-Max (IIB) @25C:

    0.00002 µA

  • Common-mode Reject Ratio-Min:

    70 dB

  • Common-mode Reject Ratio-Nom:

    84 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    3000 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Neg Supply Voltage Limit-Max:

    -18 V

  • Neg Supply Voltage-Nom (Vsup):

    -15 V

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR, 7 INCH

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Min:

    1 V/us

  • Slew Rate-Nom:

    1.8 V/us

  • Supply Current-Max:

    0.2 mA

  • Supply Voltage Limit-Max:

    18 V

  • Supply Voltage-Nom (Vsup):

    15 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    1000

  • Voltage Gain-Min:

    150000

  • Wideband:

    NO

  • Width:

    3.9 mm

AD548JRZ-REEL7 Frequently Asked Questions (FAQs)

  • A good PCB layout for the AD548JRZ involves keeping the input and output traces separate, using a ground plane, and minimizing the distance between the device and the decoupling capacitors. A 4-layer PCB with a dedicated ground plane is recommended.
  • To ensure proper decoupling, use a 10uF ceramic capacitor between the VCC and GND pins, and a 100nF ceramic capacitor between the VCC and GND pins, both placed as close to the device as possible.
  • The maximum power dissipation of the AD548JRZ is 500mW. Exceeding this limit can cause the device to overheat and potentially fail.
  • The AD548JRZ is rated for operation from -40°C to 125°C. However, the device's performance may degrade at high temperatures, and the maximum junction temperature should not exceed 150°C.
  • Common issues with the AD548JRZ include noise, oscillation, and incorrect output voltage. To troubleshoot, check the PCB layout, decoupling, and input/output connections, and ensure that the device is operated within its specified limits.

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AD548JRZ-REEL7 Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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