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AD5512AACPZ-500RL7 - Analog Devices

Description: 2.7 V to 5.5 V, Serial-Input, Voltage-Output, 12-Bit nanoDAC™ in 16-lead 3 mm × 3 mm LFCSP

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AD5512AACPZ-500RL7 - Analog Devices PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - (CP-16-22)
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AD5512AACPZ-500RL7 - Analog Devices  - 3D model - Quad Flat No-Lead - (CP-16-22)
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AD5512AACPZ-500RL7 Details

  • Manufacturer Part Number:

    AD5512AACPZ-500RL7

  • Source Url Status Check Date:

    2013-05-01 14:56:13.049

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFN

  • Package Description:

    3 X 3 MM, ROHS COMPLIANT, MO-220WEED, LFCSP-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    CP-16-22

  • Country Of Origin:

    South Korea

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Analog Output Voltage-Max:

    4.5 V

  • Analog Output Voltage-Min:

    -2 V

  • Converter Type:

    D/A CONVERTER

  • Input Bit Code:

    BINARY

  • Input Format:

    SERIAL

  • JESD-30 Code:

    S-XQCC-N16

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Linearity Error-Max (EL):

    0.0244%

  • Moisture Sensitivity Level:

    3

  • Number of Bits:

    12

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC16,.12SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.8 mm

  • Settling Time-Nom (tstl):

    1 µs

  • Supply Current-Max:

    0.15 mA

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

AD5512AACPZ-500RL7 Frequently Asked Questions (FAQs)

  • A good PCB layout for the AD5512AACPZ-500RL7 involves keeping the analog and digital grounds separate, using a solid ground plane, and minimizing noise coupling. A 4-layer PCB with a dedicated analog ground plane is recommended.
  • To ensure accurate voltage reference performance, ensure that the input voltage is within the recommended range, the device is properly decoupled, and the output is not loaded excessively. Also, consider using a low-dropout linear regulator to power the AD5512AACPZ-500RL7.
  • The recommended calibration procedure involves applying a known input voltage, measuring the output voltage, and adjusting the internal calibration registers to achieve the desired accuracy. Refer to the datasheet for specific calibration procedures.
  • To handle thermal considerations, ensure good airflow around the device, avoid blocking airflow vents, and consider using a heat sink if the device is expected to operate at high temperatures. Also, ensure that the device is operated within the recommended temperature range.
  • To minimize EMI and RFI, use a shielded enclosure, keep the device away from high-frequency sources, and use a low-pass filter on the output. Also, ensure that the PCB layout is designed to minimize radiation and susceptibility.

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AD5512AACPZ-500RL7 Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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