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AD5592RBCBZ-1-RL7 - Analog Devices

Description: Data Acquisition ADCs/DACs - Specialised 12-bit octal SPI DAC/ADC with on-chip re

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AD5592RBCBZ-1-RL7 - Analog Devices - PCB symbol
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PCB Footprints
AD5592RBCBZ-1-RL7 - Analog Devices PCB footprint - BGA - BGA - (CB-16-3)
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AD5592RBCBZ-1-RL7 - Analog Devices - 3D model - BGA - (CB-16-3)
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AD5592RBCBZ-1-RL7 Details

  • Manufacturer Part Number:

    AD5592RBCBZ-1-RL7

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    WLCSP-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    CB-16-3

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Analog Output Voltage-Max:

    5 V

  • Converter Type:

    DAC 12BIT

  • Input Bit Code:

    BINARY

  • Input Format:

    SERIAL

  • JESD-30 Code:

    S-PBGA-B16

  • JESD-609 Code:

    e1

  • Length:

    1.96 mm

  • Linearity Error-Max (EL):

    0.0244%

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    12

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA16,4X4,20

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.64 mm

  • Settling Time-Nom (tstl):

    6 µs

  • Supply Current-Max:

    2.7 mA

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.96 mm

AD5592RBCBZ-1-RL7 Frequently Asked Questions (FAQs)

  • The recommended layout and placement for the AD5592RBCBZ-1-RL7 involves keeping the device away from high-frequency noise sources, using a solid ground plane, and placing decoupling capacitors close to the device. Additionally, it is recommended to use a 4-layer PCB with a dedicated analog ground plane to minimize noise and ensure optimal performance.
  • Calibration of the AD5592RBCBZ-1-RL7 involves adjusting the internal voltage reference and gain settings to achieve optimal accuracy and linearity. This can be done using the device's built-in calibration registers and following the calibration procedure outlined in the datasheet.
  • The AD5592RBCBZ-1-RL7 has an operating temperature range of -40°C to 125°C. Temperature affects the device's performance by introducing offset and gain errors, which can be compensated for using internal calibration registers. It is recommended to operate the device within the specified temperature range to ensure optimal performance.
  • The AD5592RBCBZ-1-RL7 can be interfaced with a microcontroller or FPGA using a serial interface such as SPI or I2C. The recommended communication protocol is SPI, which allows for fast and efficient data transfer. The device's datasheet provides detailed information on the communication protocol and interface requirements.
  • The AD5592RBCBZ-1-RL7 requires a single 2.7V to 5.5V power supply. To ensure reliable operation, it is recommended to use a low-noise power supply with adequate decoupling capacitors and to follow proper PCB layout and design guidelines to minimize noise and interference.

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AD5592RBCBZ-1-RL7 Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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