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AD5592RBCPZ-1-RL7 - Analog Devices

Description: ANALOG DEVICES - AD5592RBCPZ-1-RL7 - Analogue to Digital Converter, 12 bit, 400 kSPS, SPI, Single, 2.7 V

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AD5592RBCPZ-1-RL7 - Analog Devices PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - 16-Lead Lead Frame Chip Scale Package [LFCSP] 3 mm × 3 mm Body, Very Very Thin Quad (CP-16-32)-
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AD5592RBCPZ-1-RL7 - Analog Devices  - 3D model - Quad Flat No-Lead - 16-Lead Lead Frame Chip Scale Package [LFCSP] 3 mm × 3 mm Body, Very Very Thin Quad (CP-16-32)-
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AD5592RBCPZ-1-RL7 Details

  • Manufacturer Part Number:

    AD5592RBCPZ-1-RL7

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LFCSP-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    CP-16-32

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Analog Output Voltage-Max:

    5 V

  • Converter Type:

    DAC 12BIT

  • Input Bit Code:

    BINARY

  • Input Format:

    SERIAL

  • JESD-30 Code:

    S-XQCC-N16

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Linearity Error-Max (EL):

    0.0244%

  • Moisture Sensitivity Level:

    3

  • Number of Bits:

    12

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    VQCCN

  • Package Equivalence Code:

    LCC16,.12SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.8 mm

  • Settling Time-Nom (tstl):

    6 µs

  • Supply Current-Max:

    2.7 mA

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

AD5592RBCPZ-1-RL7 Frequently Asked Questions (FAQs)

  • A good layout and routing practice is to keep the analog and digital grounds separate, use a solid ground plane, and keep the analog and digital signals separate. Also, use a low-ESR capacitor for the AVDD and DVDD pins, and keep the decoupling capacitors close to the pins.
  • Calibration involves adjusting the internal offset and gain of the ADC and DAC. The AD5592RBCPZ-1-RL7 has an internal calibration mode that can be enabled through the SPI interface. The device can also be calibrated using an external reference voltage.
  • The maximum sampling rate of the AD5592RBCPZ-1-RL7 is 400 kSPS. The power consumption increases with the sampling rate, so it's essential to optimize the sampling rate based on the application requirements to minimize power consumption.
  • The AD5592RBCPZ-1-RL7 can be interfaced with a microcontroller using the SPI interface. The critical signals that need to be connected are the SCLK, MOSI, MISO, and CS pins. The microcontroller should also provide a clock signal to the AD5592RBCPZ-1-RL7.
  • The AD5592RBCPZ-1-RL7's performance can be affected by temperature variations, which can cause changes in the offset and gain. To compensate for temperature variations, the device has an internal temperature sensor that can be used to adjust the offset and gain. Additionally, the device can be calibrated at different temperatures to minimize the effects of temperature variations.

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AD5592RBCPZ-1-RL7 Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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