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AD5593RBCBZ-RL7 - Analog Devices

Description: 1.8V ~ 5.5V, -40°C ~ 105°C IC ADC/DAC 12BIT 16WLCSP(1.96x1.96)

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AD5593RBCBZ-RL7 - Analog Devices - PCB symbol
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PCB Footprints
AD5593RBCBZ-RL7 - Analog Devices PCB footprint - BGA - BGA - 16-Ball Wafer Level Chip Scale Package [WLCSP] (CB-16-3)_2024
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AD5593RBCBZ-RL7 - Analog Devices - 3D model - BGA - 16-Ball Wafer Level Chip Scale Package [WLCSP] (CB-16-3)_2024
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AD5593RBCBZ-RL7 Details

  • Manufacturer Part Number:

    AD5593RBCBZ-RL7

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    WLCSP-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    CB-16-3

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Converter Type:

    D/A CONVERTER

  • Input Bit Code:

    BINARY

  • Input Format:

    SERIAL

  • JESD-30 Code:

    S-XQCC-N16

  • JESD-609 Code:

    e1

  • Length:

    3 mm

  • Linearity Error-Max (EL):

    0.048828%

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    12

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC16,.12SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.8 mm

  • Settling Time-Nom (tstl):

    6 µs

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

AD5593RBCBZ-RL7 Frequently Asked Questions (FAQs)

  • The AD5593RBCBZ-RL7 requires careful layout and placement to minimize noise and ensure optimal performance. It is recommended to follow the layout guidelines provided in the datasheet, including keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the analog signal sources.
  • The AD5593RBCBZ-RL7 requires calibration to achieve optimal accuracy and linearity. The calibration process involves adjusting the internal offset and gain registers to compensate for device variations and external component tolerances. The calibration procedure is described in the datasheet and application notes.
  • The recommended power-up sequence for the AD5593RBCBZ-RL7 is to apply the analog supply voltage (VCC) first, followed by the digital supply voltage (VDD). This ensures that the internal analog circuits are powered up before the digital circuits, preventing damage or malfunction.
  • The AD5593RBCBZ-RL7 has an internal clock that can be synchronized with an external clock source. To handle clock synchronization, it is recommended to use the device's clock synchronization pin (CLKSYNC) and follow the clock synchronization protocol described in the datasheet.
  • The AD5593RBCBZ-RL7 has a maximum junction temperature rating of 150°C. To prevent overheating, it is recommended to provide adequate heat sinking, use a thermal interface material, and ensure good airflow around the device. The thermal management considerations are described in the datasheet and application notes.

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AD5593RBCBZ-RL7 Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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