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AD5612BKSZ-2500RL7 - Analog Devices

Description: ANALOG DEVICES - AD5612BKSZ-2500RL7 - Digital to Analogue Converter, 10 bit, 1.7 MSPS, I2C, 2.7V to 5.5V, SC-70, 6 Pins

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PCB Footprints
AD5612BKSZ-2500RL7 - Analog Devices PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - KS-6 (SC70)_11
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AD5612BKSZ-2500RL7 - Analog Devices  - 3D model - SOT23 (6-Pin) - KS-6 (SC70)_11
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AD5612BKSZ-2500RL7 Details

  • Manufacturer Part Number:

    AD5612BKSZ-2500RL7

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Package Description:

    SC-70, 6 PIN

  • Pin Count:

    6

  • Manufacturer Package Code:

    KS-6

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Analog Output Voltage-Max:

    5.5 V

  • Converter Type:

    D/A CONVERTER

  • Input Bit Code:

    BINARY

  • Input Format:

    SERIAL

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e4

  • Length:

    2 mm

  • Linearity Error-Max (EL):

    0.048828%

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    10

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VSSOP

  • Package Equivalence Code:

    TSSOP6,.08

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1 mm

  • Settling Time-Max:

    10 µs

  • Settling Time-Nom (tstl):

    6 µs

  • Supply Current-Max:

    0.1 mA

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.25 mm

AD5612BKSZ-2500RL7 Frequently Asked Questions (FAQs)

  • A good PCB layout for the AD5612BKSZ-2500RL7 involves keeping the analog and digital grounds separate, using a solid ground plane, and minimizing noise coupling by keeping sensitive analog signals away from digital signals. A 4-layer PCB with a dedicated analog ground plane is recommended.
  • To ensure accurate voltage reference performance, it's essential to decouple the VREF pin with a 10nF capacitor to GND, and use a low-impedance voltage source for the VREF input. Additionally, keep the VREF pin away from noise sources and ensure a stable power supply.
  • The recommended power-up sequence is to apply the analog power supply (AVDD) first, followed by the digital power supply (DVDD), and then the clock signal. This ensures proper initialization and prevents latch-up conditions.
  • To handle thermal considerations, ensure good airflow around the device, and use a thermal pad or heat sink if necessary. The device's thermal pad should be connected to a solid ground plane to dissipate heat efficiently.
  • To mitigate EMI and RFI, use a shielded enclosure, keep the device away from antennas and other noise sources, and use a common-mode choke or ferrite bead on the power supply lines. Additionally, use a low-pass filter on the analog input signals to reduce high-frequency noise.

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AD5612BKSZ-2500RL7 Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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