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AD5627BCPZ-REEL7 - Analog Devices

Description: Digital to Analog Converters - DAC Dual 2.7-5.5V 12bit I2C DAC with LDAC

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AD5627BCPZ-REEL7 - Analog Devices - PCB symbol
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AD5627BCPZ-REEL7 - Analog Devices PCB footprint - Small Outline No-lead - Small Outline No-lead - CP-10-9 (LFCSP)
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AD5627BCPZ-REEL7 - Analog Devices - 3D model - Small Outline No-lead - CP-10-9 (LFCSP)
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AD5627BCPZ-REEL7 Details

  • Manufacturer Part Number:

    AD5627BCPZ-REEL7

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    3 X 3 MM, LEAD FREE, LFCSP-10

  • Pin Count:

    10

  • Manufacturer Package Code:

    CP-10-9

  • Country Of Origin:

    South Korea

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Analog Output Voltage-Max:

    5.5 V

  • Converter Type:

    D/A CONVERTER

  • Input Bit Code:

    BINARY

  • Input Format:

    SERIAL

  • JESD-30 Code:

    S-XDSO-N10

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Linearity Error-Max (EL):

    0.0244%

  • Moisture Sensitivity Level:

    3

  • Number of Bits:

    12

  • Number of Functions:

    1

  • Number of Terminals:

    10

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC10,.12,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.8 mm

  • Settling Time-Max:

    4.5 µs

  • Settling Time-Nom (tstl):

    3 µs

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

AD5627BCPZ-REEL7 Frequently Asked Questions (FAQs)

  • The recommended power-up sequence for the AD5627 is to power up VDD first, followed by VREF, and then the digital interface (SCL and SDA). This ensures that the internal reference is stable before the DAC starts operating.
  • To ensure accurate voltage output from the AD5627, it is essential to use a high-accuracy external reference voltage (VREF) and to decouple the power supply (VDD) and reference voltage (VREF) pins with suitable capacitors. Additionally, the output voltage should be buffered with an op-amp if it needs to drive a load.
  • The AD5627's output can drive a maximum capacitance of 1nF. Exceeding this limit may cause instability or oscillations in the output voltage.
  • The AD5627 has a power-down mode that can be implemented by pulling the CLR pin low. This reduces the power consumption to a minimum. However, it is essential to ensure that the power-down mode is implemented correctly to avoid any unwanted output voltage transitions.
  • The recommended layout and routing for the AD5627's PCB design involves keeping the analog and digital signal paths separate, using a solid ground plane, and minimizing the length of the traces connected to the VREF and output voltage pins. Additionally, it is essential to use a low-impedance power supply and to decouple the power supply pins with suitable capacitors.

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AD5627BCPZ-REEL7 Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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