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AD565AJR - Analog Devices

Description: Digital to Analog Converters - DAC IC MONO 12-BIT

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AD565AJR - Analog Devices - PCB symbol
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PCB Footprints
AD565AJR - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - RW-28 (SOIC)
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AD565AJR - Analog Devices - 3D model - Small Outline Packages - RW-28 (SOIC)
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AD565AJR Details

  • Manufacturer Part Number:

    AD565AJR

  • Source Url Status Check Date:

    2013-05-01 14:56:13.983

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Package Description:

    SOIC-28

  • Pin Count:

    28

  • Manufacturer Package Code:

    RW-28

  • HTS Code:

    8542.39.00.40

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    0

  • Analog Output Voltage-Max:

    10 V

  • Analog Output Voltage-Min:

    -1.5 V

  • Converter Type:

    D/A CONVERTER

  • Input Bit Code:

    BINARY, OFFSET BINARY

  • Input Format:

    PARALLEL, WORD

  • JESD-30 Code:

    R-PDSO-G28

  • JESD-609 Code:

    e0

  • Length:

    17.9 mm

  • Linearity Error-Max (EL):

    0.0122%

  • Moisture Sensitivity Level:

    3

  • Negative Supply Voltage-Nom:

    -15 V

  • Number of Bits:

    12

  • Number of Functions:

    1

  • Number of Terminals:

    28

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP28,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    240

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.65 mm

  • Settling Time-Max:

    0.35 µs

  • Settling Time-Nom (tstl):

    0.25 µs

  • Supply Current-Max:

    18 mA

  • Supply Voltage-Nom:

    15 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Tin/Lead (Sn85Pb15)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7.5 mm

AD565AJR Frequently Asked Questions (FAQs)

  • The recommended power-up sequence is to apply VCC first, followed by VREF, and then the digital inputs. This ensures that the internal circuitry is properly biased and that the device operates correctly.
  • The AD565AJR can source or sink up to 10mA of current. To handle the output current, use a buffer amplifier or an op-amp with a high output current capability. Additionally, ensure that the output is properly terminated to prevent reflections and oscillations.
  • The AD565AJR's performance is affected by temperature. The device's accuracy, linearity, and output voltage swing are all temperature-dependent. Ensure that the device is operated within its specified temperature range (-40°C to +85°C) and that proper thermal management is implemented to minimize temperature-related errors.
  • Yes, the AD565AJR can be used in a ratiometric configuration. In this configuration, the reference voltage (VREF) is derived from the power supply voltage (VCC). This allows the device to maintain a constant full-scale output voltage, even if the power supply voltage changes.
  • To minimize noise and interference, use proper PCB layout techniques, such as separating analog and digital signals, using ground planes, and minimizing signal trace lengths. Additionally, use shielding and filtering to reduce electromagnetic interference (EMI) and radio-frequency interference (RFI).

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AD565AJR Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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