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AD6642BBCZ - Analog Devices

Description: Dual IF Receiver

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PCB Footprints
AD6642BBCZ - Analog Devices PCB footprint - BGA - BGA - (BC-144-1
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AD6642BBCZ - Analog Devices  - 3D model - BGA - (BC-144-1
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AD6642BBCZ Details

  • Manufacturer Part Number:

    AD6642BBCZ

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    BGA

  • Package Description:

    10 X 10 MM, 1.40 MM HEIGHT, ROHS COMPLIANT, MO-205AC, CSPBGA-144

  • Pin Count:

    144

  • Manufacturer Package Code:

    BC-144-1

  • Country Of Origin:

    Singapore

  • ECCN Code:

    5A991.B

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • JESD-30 Code:

    S-PBGA-B144

  • JESD-609 Code:

    e1

  • Length:

    10 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    144

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA144,12X12,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.4 mm

  • Supply Current-Max:

    0.291 mA

  • Supply Voltage-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Telecom IC Type:

    RF AND BASEBAND CIRCUIT

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    10 mm

AD6642BBCZ Frequently Asked Questions (FAQs)

  • A good PCB layout for the AD6642BBCZ involves keeping the analog and digital sections separate, using a solid ground plane, and placing decoupling capacitors close to the device. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane. The datasheet provides a recommended PCB layout, but it's also recommended to consult with an experienced PCB designer for optimal results.
  • To optimize the clocking scheme for the AD6642BBCZ, it's recommended to use a low-jitter clock source, such as a crystal oscillator or a high-quality clock generator. The clock frequency should be set to the recommended value of 640 MHz, and the clock signal should be routed as a differential pair to minimize noise. Additionally, it's recommended to use a clock buffer or a clock distribution network to ensure that the clock signal is clean and stable.
  • The recommended power-up sequence for the AD6642BBCZ is to first apply the analog power supply (AVDD) and then the digital power supply (DVDD). The power supplies should be ramped up slowly to prevent voltage overshoots or undershoots. Additionally, it's recommended to ensure that the clock signal is stable and valid before applying the power supplies.
  • To troubleshoot issues with the AD6642BBCZ, it's recommended to first consult the datasheet and the device's documentation to ensure that the device is being used correctly. Next, it's recommended to use a logic analyzer or an oscilloscope to capture and analyze the device's signals, such as the clock signal, the data signals, and the control signals. Additionally, it's recommended to check the power supplies and the PCB layout to ensure that they are correct and functional.
  • The recommended method for thermal management of the AD6642BBCZ is to use a heat sink or a thermal pad to dissipate heat away from the device. The heat sink or thermal pad should be attached to the device's exposed pad, and thermal interface material (TIM) should be used to ensure good thermal contact. Additionally, it's recommended to ensure good airflow around the device and to avoid blocking the airflow with other components or obstacles.

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AD6642BBCZ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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