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AD706JNZ - Analog Devices

Description: AD706JNZ, Dual Operational Amplifier, 8-Pin PDIP

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AD706JNZ - Analog Devices PCB footprint - Dual-In-Line Packages - Dual-In-Line Packages - N-8
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AD706JNZ - Analog Devices  - 3D model - Dual-In-Line Packages - N-8
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AD706JNZ Details

  • Manufacturer Part Number:

    AD706JNZ

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DIP

  • Package Description:

    DIP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    N-8

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.0004 µA

  • Bias Current-Max (IIB) @25C:

    0.00025 µA

  • Common-mode Reject Ratio-Min:

    108 dB

  • Common-mode Reject Ratio-Nom:

    128 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    150 µV

  • JESD-30 Code:

    R-PDIP-T8

  • JESD-609 Code:

    e3

  • Length:

    9.27 mm

  • Low-Bias:

    YES

  • Low-Offset:

    YES

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Neg Supply Voltage Limit-Max:

    -18 V

  • Neg Supply Voltage-Nom (Vsup):

    -15 V

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP8,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Packing Method:

    TUBE

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    4.57 mm

  • Slew Rate-Nom:

    0.15 V/us

  • Supply Current-Max:

    1.4 mA

  • Supply Voltage Limit-Max:

    18 V

  • Supply Voltage-Nom (Vsup):

    15 V

  • Surface Mount:

    NO

  • Technology:

    BIPOLAR

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Unity Gain BW-Nom:

    800

  • Voltage Gain-Min:

    150000

  • Wideband:

    NO

  • Width:

    7.62 mm

AD706JNZ Frequently Asked Questions (FAQs)

  • The maximum power dissipation of the AD706JNZ is 670mW, which is calculated based on the maximum junction temperature (TJ) of 150°C and the thermal resistance (θJA) of 125°C/W.
  • To ensure stability in a unity-gain configuration, it's recommended to add a capacitor (typically 10-100pF) between the output and the inverting input to compensate for the internal pole. Additionally, ensure that the layout is well-designed to minimize parasitic capacitance and inductance.
  • The recommended input common-mode voltage range for the AD706JNZ is between VEE + 2V and VCC - 2V, where VEE is the negative supply voltage and VCC is the positive supply voltage.
  • While the AD706JNZ can be used as a comparator, it's not the most suitable choice due to its relatively slow slew rate (0.5V/μs) and limited bandwidth (3MHz). A dedicated comparator like the AD790 or AD861 would be a better choice for most applications.
  • The AD706JNZ has internal ESD protection, but it's still recommended to follow proper PCB design and handling practices to prevent ESD damage. Use ESD-protective packaging, handle the devices by the body, and avoid touching the pins or leads.

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AD706JNZ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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