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AD7303BRMZ - Analog Devices

Description: DAC 2-Ch Current Steering 8-Bit 8-MSOP

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AD7303BRMZ - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - RM-8 (MSOP)_2
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AD7303BRMZ - Analog Devices  - 3D model - Small Outline Packages - RM-8 (MSOP)_2
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AD7303BRMZ Details

  • Manufacturer Part Number:

    AD7303BRMZ

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    ROHS COMPLIANT, MICRO, SOIC-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    RM-8

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Analog Output Voltage-Max:

    5.5 V

  • Converter Type:

    D/A CONVERTER

  • Input Bit Code:

    BINARY

  • Input Format:

    SERIAL

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Linearity Error-Max (EL):

    0.3906%

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    8

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Settling Time-Max:

    2 µs

  • Settling Time-Nom (tstl):

    1.2 µs

  • Supply Current-Max:

    3.5 mA

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

AD7303BRMZ Frequently Asked Questions (FAQs)

  • A good layout and routing practice is to keep the analog and digital grounds separate, use a solid ground plane, and keep the sensitive analog signals away from the digital signals. Also, use short and direct traces for the analog signals and avoid crossing digital signals over the analog signals.
  • The AD7303BRMZ has an internal calibration circuit that can be enabled by setting the CAL pin high. The device will then perform a self-calibration sequence. Additionally, the user can also perform an external calibration by applying a known voltage to the input pins and adjusting the offset and gain registers accordingly.
  • The maximum sampling rate of the AD7303BRMZ is 100 kSPS. However, the actual sampling rate may be limited by the system's clock frequency, the conversion time, and the settling time of the input signal.
  • If the input voltage exceeds the maximum rating of the AD7303BRMZ, it is recommended to use an external voltage limiter or a voltage divider to reduce the input voltage to within the specified range. Additionally, the user can also use an external over-voltage protection circuit to prevent damage to the device.
  • The recommended power-up sequence for the AD7303BRMZ is to first apply the analog power supply (AVDD) and then the digital power supply (DVDD). The power-up sequence should be controlled to ensure that the analog power supply is stable before the digital power supply is applied.

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AD7303BRMZ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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