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AD74115BCPZ - Analog Devices

Description: Single-Channel, Software Configurable Input and Output

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PCB Footprints
AD74115BCPZ - Analog Devices PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - 48-Lead Lead Frame Chip Scale Package [LFCSP] 7 mm × 7 mm and 0.75 mm Package Height (CP-48-13)
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3D Models
AD74115BCPZ - Analog Devices  - 3D model - Quad Flat No-Lead - 48-Lead Lead Frame Chip Scale Package [LFCSP] 7 mm × 7 mm and 0.75 mm Package Height (CP-48-13)
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AD74115BCPZ Details

  • Manufacturer Part Number:

    AD74115BCPZ

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    LFCSP:LEADFRM CHIP SCALE

  • Package Description:

    LFCSP-48

  • Pin Count:

    48

  • Manufacturer Package Code:

    LFCSP:LEADFRM CHIP SCALE

  • HTS Code:

    8542.39.00.01

  • Date Of Intro:

    2023-01-31

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    8.5

  • Interface IC Type:

    DIGITAL I/O MODULE

  • JESD-30 Code:

    S-PQCC-N48

  • JESD-609 Code:

    e3

  • Length:

    7 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    48

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC48,.27SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.8 mm

  • Supply Voltage-Max:

    28.8 V

  • Supply Voltage-Min:

    6 V

  • Supply Voltage-Nom:

    24 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7 mm

AD74115BCPZ Frequently Asked Questions (FAQs)

  • For optimal performance, it's recommended to follow a star-grounding layout, keeping the analog and digital grounds separate. Place the device close to the analog signal sources, and use a solid ground plane to minimize noise and EMI.
  • To ensure accurate temperature measurements, calibrate the device using the on-chip calibration registers. Also, ensure good thermal coupling between the device and the target temperature source, and avoid self-heating effects by minimizing power consumption.
  • The maximum cable length for remote temperature sensing depends on the cable type, noise environment, and desired accuracy. As a general guideline, use shielded twisted-pair cables up to 10 meters long, and consider using signal conditioning or amplification for longer cable lengths.
  • Yes, the AD74115BCPZ supports multi-drop bus configuration. However, ensure that each device has a unique address, and follow the recommended bus layout and termination guidelines to minimize signal reflections and noise.
  • The AD74115BCPZ provides error flags and fault detection mechanisms. Implement error handling routines to detect and respond to faults, such as thermocouple breaks, over/under-temperature conditions, and communication errors.

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AD74115BCPZ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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