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AD75019JPZ - Analog Devices

Description: AD75019JPZ, Crosspoint Switch, 16 x 16, 44-Pin PLCC, PLCC

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AD75019JPZ - Analog Devices PCB footprint - Plastic Leaded Chip Carrier - Plastic Leaded Chip Carrier - AD75019JPZ-1
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AD75019JPZ - Analog Devices  - 3D model - Plastic Leaded Chip Carrier - AD75019JPZ-1
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AD75019JPZ Details

  • Manufacturer Part Number:

    AD75019JPZ

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    LCC

  • Package Description:

    PLASTIC, LCC-44

  • Pin Count:

    44

  • Manufacturer Package Code:

    P-44A

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Analog IC - Other Type:

    CROSS POINT SWITCH

  • JESD-30 Code:

    S-PQCC-J44

  • JESD-609 Code:

    e3

  • Length:

    16.5862 mm

  • Moisture Sensitivity Level:

    3

  • Neg Supply Voltage-Max (Vsup):

    -25.2 V

  • Neg Supply Voltage-Min (Vsup):

    -9 V

  • Neg Supply Voltage-Nom (Vsup):

    -12 V

  • Number of Channels:

    16

  • Number of Functions:

    1

  • Number of Terminals:

    44

  • Off-state Isolation-Nom:

    92 dB

  • On-state Resistance Match-Nom:

    20 Ω

  • On-state Resistance-Max (Ron):

    300 Ω

  • Operating Temperature-Max:

    70 °C

  • Output:

    SEPARATE OUTPUT

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    QCCJ

  • Package Equivalence Code:

    LDCC44,.7SQ

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    4.57 mm

  • Supply Current-Max (Isup):

    0.8 mA

  • Supply Voltage-Max (Vsup):

    25.2 V

  • Supply Voltage-Min (Vsup):

    9 V

  • Supply Voltage-Nom (Vsup):

    12 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    70 ns

  • Switch-on Time-Max:

    70 ns

  • Technology:

    BICMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    J BEND

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    16.5862 mm

AD75019JPZ Frequently Asked Questions (FAQs)

  • A good layout and routing practice is to keep the analog and digital grounds separate, use a solid ground plane, and keep the analog and digital signal traces separate. Additionally, use a low-ESR capacitor for decoupling and place it close to the device.
  • Calibration involves adjusting the internal offset and gain of the device. Follow the calibration procedure outlined in the datasheet, which involves applying a known input voltage and adjusting the offset and gain registers accordingly.
  • The recommended power-up sequence is to apply the analog power supply (AVDD) first, followed by the digital power supply (DVDD), and then the clock signal. This ensures that the analog circuitry is powered up before the digital circuitry.
  • The AD75019JPZ has an internal clock that can be synchronized with an external clock source. To handle clock synchronization, use the CLKIN pin to connect an external clock source, and configure the clock synchronization registers according to the datasheet.
  • The AD75019JPZ has a maximum junction temperature of 150°C. Ensure reliable operation over temperature by providing adequate heat sinking, using a thermally conductive package, and following the recommended thermal design guidelines.

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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