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AD7847BRZ - Analog Devices

Description: AD7847BRZ, 12 bit-Bit DAC Dual, 250ksps, Parallel, 24-Pin SOIC W

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AD7847BRZ - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - R-24 (SOIC)_1
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AD7847BRZ Details

  • Manufacturer Part Number:

    AD7847BRZ

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    SOIC-24

  • Pin Count:

    24

  • Manufacturer Package Code:

    RW-24

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Analog Output Voltage-Max:

    10 V

  • Analog Output Voltage-Min:

    -10 V

  • Converter Type:

    D/A CONVERTER

  • Input Bit Code:

    BINARY, OFFSET BINARY

  • Input Format:

    PARALLEL, WORD

  • JESD-30 Code:

    R-PDSO-G24

  • JESD-609 Code:

    e3

  • Length:

    15.4 mm

  • Linearity Error-Max (EL):

    0.0122%

  • Moisture Sensitivity Level:

    3

  • Negative Supply Voltage-Nom:

    -15 V

  • Number of Bits:

    12

  • Number of Functions:

    2

  • Number of Terminals:

    24

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP24,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.65 mm

  • Settling Time-Nom (tstl):

    3 µs

  • Supply Current-Max:

    10 mA

  • Supply Voltage-Nom:

    15 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Width:

    7.5 mm

AD7847BRZ Frequently Asked Questions (FAQs)

  • A good layout and routing practice is to keep the analog and digital grounds separate, use a solid ground plane, and keep the analog and digital signal traces separate. Also, place the AD7847BRZ close to the analog signal sources and use short, direct traces to minimize noise pickup.
  • The AD7847BRZ has an internal calibration circuit that can be enabled by setting the CAL pin high. The device will then perform a self-calibration sequence. Additionally, the user can perform an external calibration by applying a known voltage to the input and adjusting the offset and gain registers accordingly.
  • The recommended power-up sequence is to apply the analog power supply (AVDD) first, followed by the digital power supply (DVDD), and then the clock signal. This ensures that the analog circuitry is powered up before the digital circuitry, preventing any potential damage or incorrect operation.
  • The AD7847BRZ outputs data in a 16-bit, two's complement format. The user can select the output data format and word length by configuring the device's control registers. The device also has a built-in feature to insert a dummy cycle between conversions to ensure compatibility with systems that require a specific data format.
  • The AD7847BRZ has a maximum junction temperature of 150°C. To prevent overheating, ensure good airflow around the device, use a heat sink if necessary, and avoid blocking the airflow around the device. Also, follow the recommended PCB layout and thermal design guidelines to minimize thermal resistance.

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AD7847BRZ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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