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AD8001ANZ - Analog Devices

Description: 800 MHz, 50 mW Current Feedback Amplifier

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AD8001ANZ - Analog Devices PCB footprint - Dual-In-Line Packages - Dual-In-Line Packages - AD8001ANZ
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AD8001ANZ Details

  • Manufacturer Part Number:

    AD8001ANZ

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DIP

  • Package Description:

    ROHS COMPLIANT, PLASTIC, DIP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    N-8

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    CURRENT-FEEDBACK

  • Bias Current-Max (IIB) @25C:

    25 µA

  • Common-mode Reject Ratio-Min:

    50 dB

  • Common-mode Reject Ratio-Nom:

    54 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    9000 µV

  • JESD-30 Code:

    R-PDIP-T8

  • JESD-609 Code:

    e3

  • Length:

    9.27 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Neg Supply Voltage Limit-Max:

    -6.3 V

  • Neg Supply Voltage-Nom (Vsup):

    -5 V

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP8,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Packing Method:

    TUBE

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    4.57 mm

  • Slew Rate-Min:

    800 V/us

  • Slew Rate-Nom:

    1000 V/us

  • Supply Current-Max:

    5.5 mA

  • Supply Voltage Limit-Max:

    6.3 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    NO

  • Technology:

    BIPOLAR

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Wideband:

    YES

  • Width:

    7.62 mm

AD8001ANZ Frequently Asked Questions (FAQs)

  • The maximum power dissipation of the AD8001ANZ is 670mW, which is calculated based on the maximum junction temperature (TJ) of 150°C and the thermal resistance (θJA) of 125°C/W.
  • To ensure stability in a gain-of-10 configuration, it's recommended to add a 10nF to 22nF capacitor in parallel with a 1kΩ to 2kΩ resistor between the output and the inverting input. This helps to compensate for the phase shift and ensure stability.
  • For optimal performance, it's recommended to use a star-grounding technique, where the analog and digital grounds are separated and connected at a single point. Additionally, keep the input and output traces short and away from noise sources, and use a solid ground plane to reduce electromagnetic interference (EMI).
  • Yes, the AD8001ANZ can be used in a single-supply configuration. However, the input common-mode voltage range is limited to VCC - 2V to VCC + 0.5V. To ensure proper operation, the input signal should be biased to a voltage within this range.
  • To reduce noise and EMI, use a low-pass filter at the input, keep the input and output traces short and away from noise sources, and use a shielded enclosure or a metal can package. Additionally, decouple the power supply with a 10uF capacitor and a 100nF capacitor in parallel.

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AD8001ANZ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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