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AD8051ARZ - Analog Devices

Description: High Speed Operational Amplifiers SOIC Single 200MHz L/C Rail-to-Rail Amp

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AD8051ARZ - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - R-8 (SOIC)
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AD8051ARZ Details

  • Manufacturer Part Number:

    AD8051ARZ

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    SOIC-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    R-8

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    8.5

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    3.5 µA

  • Bias Current-Max (IIB) @25C:

    2.6 µA

  • Common-mode Reject Ratio-Min:

    72 dB

  • Common-mode Reject Ratio-Nom:

    88 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    27000 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Neg Supply Voltage Limit-Max:

    -6.3 V

  • Neg Supply Voltage-Nom (Vsup):

    -5 V

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Min:

    90 V/us

  • Slew Rate-Nom:

    170 V/us

  • Supply Current-Max:

    5.5 mA

  • Supply Voltage Limit-Max:

    6.3 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    110000

  • Voltage Gain-Min:

    5000

  • Wideband:

    YES

  • Width:

    3.9 mm

AD8051ARZ Frequently Asked Questions (FAQs)

  • The maximum power dissipation of the AD8051ARZ is 670mW, which is calculated based on the maximum junction temperature (TJ) of 150°C and the thermal resistance (θJA) of 125°C/W.
  • To ensure stability, add a capacitor (typically 10-100pF) between the output and the inverting input to compensate for the phase shift caused by the op-amp's internal compensation capacitor.
  • Use a star-ground configuration, keep the input and output traces short and separate, and avoid running digital signals near the analog signals. Also, use a low-ESR capacitor (e.g., 10uF) between the power pins to reduce noise.
  • Yes, the AD8051ARZ can be used as a comparator. Connect the input signal to the non-inverting input and the reference voltage to the inverting input. Use a pull-up resistor (e.g., 1kΩ) on the output to VCC to ensure a valid logic level.
  • Use input protection diodes (e.g., 1N4148) or a voltage clamp circuit to limit the input voltage to within the specified range (±VCC + 0.5V). You can also add a series resistor to limit the input current.

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AD8051ARZ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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