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AD8075ARUZ - Analog Devices

Description: AD8075ARUZ, Video Buffer 4.5 → 5.5 V 16-Pin TSSOP

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AD8075ARUZ - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - RU-16 (TSSOP)
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AD8075ARUZ - Analog Devices  - 3D model - Small Outline Packages - RU-16 (TSSOP)
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AD8075ARUZ Details

  • Manufacturer Part Number:

    AD8075ARUZ

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Package Description:

    ROHS COMPLIANT, PLASTIC, TSSOP-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    RU-16

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Amplifier Type:

    BUFFER

  • Average Bias Current-Max (IIB):

    10 µA

  • Bandwidth (3dB)-Nom:

    550 MHz

  • Bias Current-Max (IIB) @25C:

    10 µA

  • Input Offset Voltage-Max:

    40000 µV

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    1

  • Neg Supply Voltage Limit-Max:

    -6 V

  • Neg Supply Voltage-Nom (Vsup):

    -5 V

  • Number of Functions:

    3

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Slew Rate-Nom:

    1350 V/us

  • Supply Current-Max:

    30 mA

  • Supply Voltage Limit-Max:

    6 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

AD8075ARUZ Frequently Asked Questions (FAQs)

  • A good layout and routing for the AD8075ARUZ involves keeping the analog and digital grounds separate, using a solid ground plane, and minimizing the length of the input traces. It's also recommended to use a 4-layer PCB with a dedicated analog ground plane.
  • To optimize the performance of the AD8075ARUZ in a noisy environment, use shielding, filtering, and decoupling capacitors to reduce electromagnetic interference (EMI). Also, consider using a common-mode choke or a ferrite bead to filter out high-frequency noise.
  • The AD8075ARUZ can operate over a temperature range of -40°C to +125°C, but the device's performance may degrade at extreme temperatures. It's recommended to operate the device within a temperature range of 0°C to +70°C for optimal performance.
  • To troubleshoot common issues with the AD8075ARUZ, check the power supply voltage, decoupling capacitors, and PCB layout. Ensure that the input and output capacitors are properly sized and placed. Also, verify that the device is operated within its recommended operating conditions.
  • The AD8075ARUZ is a commercial-grade device, and its use in high-reliability or safety-critical applications may require additional testing and validation. It's recommended to consult with Analog Devices Inc. or a qualified reliability engineer to determine the device's suitability for such applications.

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AD8075ARUZ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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