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AD8137YCPZ-R2 - Analog Devices

Description: Analog Devices AD8137YCPZ-R2, Differential Amplifier 110MHz Rail to Rail Output 8-Pin LFCSP

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AD8137YCPZ-R2 - Analog Devices PCB footprint - Small Outline No-lead - Small Outline No-lead - (CP-8-13)
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AD8137YCPZ-R2 - Analog Devices  - 3D model - Small Outline No-lead - (CP-8-13)
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AD8137YCPZ-R2 Details

  • Manufacturer Part Number:

    AD8137YCPZ-R2

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Package Description:

    3 X 3 MM, ROHS COMPLIANT, LFCSP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    CP-8-2

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    0

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    1 µA

  • Bias Current-Max (IIB) @25C:

    1.1 µA

  • Common-mode Reject Ratio-Min:

    66 dB

  • Common-mode Reject Ratio-Nom:

    79 dB

  • Frequency Compensation:

    NO

  • Input Offset Voltage-Max:

    2600 µV

  • JESD-30 Code:

    S-PDSO-N8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    3

  • Neg Supply Voltage Limit-Max:

    -6 V

  • Neg Supply Voltage-Nom (Vsup):

    -5 V

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC8,.11,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.9 mm

  • Slew Rate-Nom:

    450 V/us

  • Supply Current-Max:

    3.6 mA

  • Supply Voltage Limit-Max:

    6 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Wideband:

    YES

  • Width:

    3 mm

AD8137YCPZ-R2 Frequently Asked Questions (FAQs)

  • A good PCB layout for the AD8137YCPZ-R2 involves keeping the input and output traces short and symmetrical, using a solid ground plane, and placing the device close to the signal sources. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a solid ground plane to minimize noise and electromagnetic interference (EMI).
  • To optimize the gain and bandwidth of the AD8137YCPZ-R2, you can adjust the gain resistors (Rf and Rg) and the feedback capacitor (Cf) according to the datasheet's equations and graphs. You can also use simulation tools like SPICE or LTspice to model and optimize the circuit for your specific application.
  • The AD8137YCPZ-R2 has a maximum junction temperature (TJ) of 150°C. To ensure reliable operation over temperature, it's essential to provide adequate heat sinking, keep the device away from heat sources, and avoid exceeding the maximum power dissipation. You can also use thermal simulation tools to estimate the device's temperature rise and optimize the thermal design.
  • To troubleshoot common issues with the AD8137YCPZ-R2, start by checking the PCB layout and ensuring that it meets the recommended layout guidelines. Then, verify that the power supply is stable and within the recommended range. Use an oscilloscope to check for oscillations or instability, and adjust the gain and bandwidth settings accordingly. If the issue persists, consult the datasheet and application notes for troubleshooting guides and FAQs.
  • To ensure EMC with the AD8137YCPZ-R2, follow proper PCB layout and shielding techniques, use a solid ground plane, and minimize loop areas. Use EMI filters or common-mode chokes to reduce emissions, and ensure that the device is properly decoupled from the power supply. Additionally, follow the guidelines in the datasheet and relevant industry standards (e.g., CISPR, FCC) to ensure compliance with EMI and RFI regulations.

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AD8137YCPZ-R2 Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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