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AD8152JBPZ - Analog Devices

Description: Analog Devices AD8152JBPZ, Crosspoint Switch 34 x 34

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AD8152JBPZ - Analog Devices - PCB symbol
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AD8152JBPZ - Analog Devices PCB footprint - BGA - BGA - BP-256-3
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AD8152JBPZ - Analog Devices - 3D model - BGA - BP-256-3
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AD8152JBPZ Details

  • Manufacturer Part Number:

    AD8152JBPZ

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    BGA

  • Package Description:

    27 X 27 MM, 1.27 MM PITCH, PLASTIC, MO-192BAL-2, SBGA-256

  • Pin Count:

    256

  • Manufacturer Package Code:

    BP-256-3

  • Country Of Origin:

    Philippines

  • ECCN Code:

    5A991.B

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Analog IC - Other Type:

    CROSS POINT SWITCH

  • JESD-30 Code:

    S-PBGA-B256

  • JESD-609 Code:

    e1

  • Length:

    27 mm

  • Moisture Sensitivity Level:

    3

  • Number of Channels:

    34

  • Number of Functions:

    1

  • Number of Terminals:

    256

  • On-state Resistance-Max (Ron):

    57 Ω

  • Operating Temperature-Max:

    85 °C

  • Output:

    SEPARATE OUTPUT

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LBGA

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.7 mm

  • Supply Voltage-Max (Vsup):

    3.63 V

  • Supply Voltage-Min (Vsup):

    2.25 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    27 mm

AD8152JBPZ Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the analog and digital grounds separate and connect them at a single point. Use short, direct traces for the input and output signals, and avoid crossing signal lines.
  • Ensure good airflow around the device, and consider using a heat sink if the device is expected to operate in high-temperature environments. Also, follow proper thermal design and layout guidelines to minimize thermal resistance.
  • Power up the device in the following sequence: VCC, AVCC, and then DVCC. Ensure that the power supplies are stable and within the recommended voltage range before applying signals to the device.
  • Use a shielded enclosure, keep the device away from high-frequency sources, and use EMI filters or chokes on the input and output lines. Also, ensure good grounding and decoupling of the device.
  • Use a low-impedance source, such as a voltage-controlled current source, to drive the input signals. Ensure the input signals are within the recommended voltage range and have a sufficient slew rate.

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AD8152JBPZ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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