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AD8270ACPZ-RL - Analog Devices

Description: Differential Amplifier 2 Circuit Rail-to-Rail 16-LFCSP-VQ (4x4)

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PCB Footprints
AD8270ACPZ-RL - Analog Devices PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - LFCSP CP-16-20
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3D Models
AD8270ACPZ-RL - Analog Devices  - 3D model - Quad Flat No-Lead - LFCSP CP-16-20
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AD8270ACPZ-RL Details

  • Manufacturer Part Number:

    AD8270ACPZ-RL

  • Source Url Status Check Date:

    2013-05-01 14:56:25.153

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    CSP

  • Package Description:

    LFCSP-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    CP-16-20

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Common-mode Reject Ratio-Min:

    80 dB

  • Common-mode Reject Ratio-Nom:

    98 dB

  • Frequency Compensation:

    NO

  • JESD-30 Code:

    S-PQCC-N16

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Low-Bias:

    YES

  • Low-Offset:

    YES

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    3

  • Neg Supply Voltage-Nom (Vsup):

    -15 V

  • Number of Functions:

    2

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC16,.12SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.8 mm

  • Slew Rate-Nom:

    30 V/us

  • Supply Current-Max:

    4 mA

  • Supply Voltage Limit-Max:

    18 V

  • Supply Voltage-Nom (Vsup):

    15 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.635 mm

  • Terminal Position:

    QUAD

  • Wideband:

    NO

  • Width:

    3 mm

AD8270ACPZ-RL Frequently Asked Questions (FAQs)

  • A good PCB layout for the AD8270 involves keeping the input and output traces short and away from noise sources, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated analog ground plane is recommended.
  • The AD8270 is specified to operate from -40°C to 125°C. Ensure that the device is properly heatsinked, and the ambient temperature is within the specified range. Also, consider the power dissipation and thermal resistance of the package when designing the system.
  • The recommended input impedance for the AD8270 is 1 kΩ or higher. This ensures that the input voltage is not attenuated and the device operates within its specified common-mode range.
  • Yes, the AD8270 can be used with a single-supply voltage. However, the input common-mode range is limited to VCC - 1.5V to VCC + 0.5V. Ensure that the input signal is within this range to maintain optimal performance.
  • To reduce noise and EMI, use a low-noise power supply, add decoupling capacitors close to the device, and use shielding or guard rings around the input and output traces. Also, consider using a common-mode choke or ferrite beads to filter out high-frequency noise.

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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