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AD8302ARU-REEL7 - Analog Devices

Description: IC DETECTOR RF/IF 14-TSSOP

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AD8302ARU-REEL7 - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - RU-14 (TSSOP)
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AD8302ARU-REEL7 - Analog Devices - 3D model - Small Outline Packages - RU-14 (TSSOP)
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AD8302ARU-REEL7 Details

  • Manufacturer Part Number:

    AD8302ARU-REEL7

  • Source Url Status Check Date:

    2013-05-01 14:56:25.295

  • Pbfree Code:

    No

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TSSOP

  • Package Description:

    TSSOP-14

  • Pin Count:

    14

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    0

  • Analog IC - Other Type:

    ANALOG CIRCUIT

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e0

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    240

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    TIN LEAD

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Width:

    4.4 mm

AD8302ARU-REEL7 Frequently Asked Questions (FAQs)

  • A good PCB layout for the AD8302ARU-REEL7 involves keeping the input and output traces short and away from each other, using a solid ground plane, and decoupling the power supply pins with capacitors. A 4-layer PCB with a dedicated ground plane is recommended. Additionally, the datasheet provides a recommended PCB layout and land pattern that should be followed.
  • To ensure accuracy, it's essential to calibrate the AD8302ARU-REEL7 using a known reference signal. The device should be operated within its specified temperature range, and the input signals should be within the recommended amplitude and frequency ranges. Additionally, the device's output should be buffered with a high-impedance amplifier to prevent loading effects.
  • The AD8302ARU-REEL7 can measure frequencies up to 2.7 GHz, but the device's performance may degrade at higher frequencies due to internal parasitics and layout limitations. For accurate measurements above 1 GHz, it's recommended to use a high-frequency amplifier or buffer at the input stage.
  • The AD8302ARU-REEL7 outputs two analog signals representing the gain and phase information. These signals can be digitized using an ADC, and the resulting data can be processed using a microcontroller or FPGA. A recommended data acquisition method involves using a 12-bit or 14-bit ADC with a sampling rate of at least 10 times the maximum frequency of interest.
  • The AD8302ARU-REEL7 has a maximum junction temperature of 150°C. To prevent overheating, ensure good thermal conductivity between the device and the PCB, use a heat sink or thermal pad, and keep the device away from heat sources. The device's power consumption should also be minimized by using a low-power supply voltage and reducing the input signal amplitude.

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AD8302ARU-REEL7 Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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