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AD8305ACP-R2 - Analog Devices

Description: IC LOGARITHMIC CONVERTER 16LFCSP

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AD8305ACP-R2 - Analog Devices - PCB symbol
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PCB Footprints
AD8305ACP-R2 - Analog Devices PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - (CP-16-21)
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AD8305ACP-R2 - Analog Devices - 3D model - Quad Flat No-Lead - (CP-16-21)
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AD8305ACP-R2 Details

  • Manufacturer Part Number:

    AD8305ACP-R2

  • Source Url Status Check Date:

    2013-05-01 14:56:25.33

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    QFN

  • Package Description:

    LFCSP-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    CP-16-2

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    0

  • Analog IC - Other Type:

    LOG OR ANTILOG AMPLIFIER

  • Bandwidth-Nom:

    15 MHz

  • JESD-30 Code:

    S-XQCC-N16

  • JESD-609 Code:

    e0

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    3

  • Neg Supply Voltage-Max (Vsup):

    -5.5 V

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    VQCCN

  • Package Equivalence Code:

    LCC16,.12SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    240

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max (Vsup):

    12 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Lead (Sn85Pb15)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    3 mm

AD8305ACP-R2 Frequently Asked Questions (FAQs)

  • A good PCB layout for the AD8305ACP-R2 involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated ground plane is recommended. Refer to the AD8305 evaluation board layout as a reference.
  • To ensure accurate gain and phase measurements, it's essential to calibrate the device using a known reference signal. The AD8305ACP-R2 has a calibration mode that allows you to store the gain and phase correction values. Additionally, use a high-quality reference signal, and ensure that the input signals are within the recommended amplitude range.
  • The AD8305ACP-R2 can operate up to 2.7 GHz, but the maximum frequency range depends on the specific application and the quality of the input signals. In general, the device can accurately measure gain and phase up to 1.5 GHz, but some degradation in performance may occur above 1 GHz.
  • The AD8305ACP-R2 has a serial interface that can be connected to a microcontroller or FPGA using a SPI or I2C interface. The device requires a 3.3V or 5V power supply, and the interface signals should be level-shifted accordingly. Refer to the datasheet for specific interface timing and protocol requirements.
  • The AD8305ACP-R2 has a typical power consumption of 35 mA at 3.3V and 50 mA at 5V. However, the actual power consumption may vary depending on the operating frequency, input signal amplitude, and other factors. It's essential to ensure that the power supply can provide the required current to maintain accurate measurements.

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AD8305ACP-R2 Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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