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AD847ARZ-REEL7 - Analog Devices

Description: High speed & WideBandOpAmps High-speed broadband amplifier 1 ±4.5V ~ 15V 50MHz 300 V/us SOIC-8_150mil RoHS

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AD847ARZ-REEL7 - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - R-8 (SOIC)_3
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AD847ARZ-REEL7 Details

  • Manufacturer Part Number:

    AD847ARZ-REEL7

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    SOIC-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    R-8

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    10 µA

  • Bias Current-Max (IIB) @25C:

    6.6 µA

  • Common-mode Reject Ratio-Min:

    80 dB

  • Common-mode Reject Ratio-Nom:

    95 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    4000 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Neg Supply Voltage Limit-Max:

    -18 V

  • Neg Supply Voltage-Nom (Vsup):

    -5 V

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR, 7 INCH

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    YES

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.59 mm

  • Slew Rate-Min:

    225 V/us

  • Slew Rate-Nom:

    200 V/us

  • Supply Current-Max:

    7.6 mA

  • Supply Voltage Limit-Max:

    18 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Unity Gain BW-Nom:

    35000

  • Voltage Gain-Min:

    1000

  • Wideband:

    NO

  • Width:

    3.9 mm

AD847ARZ-REEL7 Frequently Asked Questions (FAQs)

  • A good PCB layout for the AD847ARZ involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated ground plane is recommended.
  • The AD847ARZ is rated for operation from -40°C to 125°C. Ensure good airflow around the device, avoid overheating, and use a heat sink if necessary. Monitor the device's junction temperature (TJ) to prevent overheating.
  • Power up the AD847ARZ in the following sequence: VCC, then VIN+, then VIN-. This ensures that the internal biasing circuitry is properly established before the input signals are applied.
  • Use a shielded enclosure, keep the AD847ARZ away from high-frequency sources, and use a common-mode choke or ferrite bead on the input lines to reduce EMI. Also, ensure good grounding and decoupling practices.
  • The maximum allowable input voltage for the AD847ARZ is ±VCC + 0.3V. Exceeding this limit can cause damage to the device.

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AD847ARZ-REEL7 Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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