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AD8582ARZ - Analog Devices

Description: AD8582ARZ, 12 bit-Bit DAC Dual, 62.5ksps, Parallel, 24-Pin SOIC W

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AD8582ARZ - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - SOL-24
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AD8582ARZ Details

  • Manufacturer Part Number:

    AD8582ARZ

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    SOIC-24

  • Pin Count:

    24

  • Manufacturer Package Code:

    RW-24

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Analog Output Voltage-Max:

    4.095 V

  • Converter Type:

    D/A CONVERTER

  • Input Bit Code:

    BINARY

  • Input Format:

    PARALLEL, WORD

  • JESD-30 Code:

    R-PDSO-G24

  • JESD-609 Code:

    e3

  • Length:

    15.4 mm

  • Linearity Error-Max (EL):

    0.05%

  • Moisture Sensitivity Level:

    3

  • Number of Bits:

    12

  • Number of Functions:

    2

  • Number of Terminals:

    24

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP24,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.65 mm

  • Settling Time-Nom (tstl):

    16 µs

  • Supply Current-Max:

    7 mA

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7.5 mm

AD8582ARZ Frequently Asked Questions (FAQs)

  • The AD8582ARZ is a high-precision, high-speed amplifier, and as such, it requires careful layout and placement to minimize noise and ensure optimal performance. A recommended layout and placement is to keep the input and output traces short and away from noise sources, use a solid ground plane, and decouple the power supplies with 0.1uF and 10uF capacitors.
  • To optimize the gain and bandwidth of the AD8582ARZ, it is recommended to use the gain-setting resistors (Rg) and the compensation capacitor (Cc) as described in the datasheet. Additionally, the gain and bandwidth can be optimized by adjusting the values of Rg and Cc, and by using a feedback capacitor (Cf) to improve the stability and bandwidth of the amplifier.
  • The recommended power supply decoupling for the AD8582ARZ is to use a combination of 0.1uF and 10uF capacitors in parallel, placed as close as possible to the power pins of the device. This helps to filter out high-frequency noise and ensure stable operation.
  • To minimize noise and EMI in your AD8582ARZ design, it is recommended to use a solid ground plane, keep the input and output traces short and away from noise sources, use shielding and filtering, and avoid running digital and analog traces parallel to each other.
  • The recommended thermal management for the AD8582ARZ is to ensure good airflow around the device, use a heat sink if necessary, and avoid blocking the airflow around the device. The device has a maximum junction temperature of 150°C, and it is recommended to keep the junction temperature below 125°C for optimal performance and reliability.

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AD8582ARZ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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