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AD8607ARZ - Analog Devices

Description: AD8607ARZ, Dual Operational Amplifier 0.4MHz CMOS, R-R, 3V, 8-Pin SOIC

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AD8607ARZ - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - SOIC 8_2020
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AD8607ARZ - Analog Devices  - 3D model - Small Outline Packages - SOIC 8_2020
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AD8607ARZ Details

  • Manufacturer Part Number:

    AD8607ARZ

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    8

  • Manufacturer Package Code:

    R-8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.0005 µA

  • Bias Current-Max (IIB) @25C:

    0.000001 µA

  • Common-mode Reject Ratio-Min:

    70 dB

  • Common-mode Reject Ratio-Nom:

    98 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    700 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Low-Bias:

    YES

  • Low-Offset:

    YES

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Nom:

    0.1 V/us

  • Supply Current-Max:

    0.12 mA

  • Supply Voltage Limit-Max:

    6 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    385

  • Voltage Gain-Min:

    100000

  • Wideband:

    NO

  • Width:

    3.9 mm

AD8607ARZ Frequently Asked Questions (FAQs)

  • The maximum power dissipation of the AD8607ARZ is 670mW, which is calculated based on the maximum junction temperature (TJ) of 150°C and the thermal resistance (θJA) of 125°C/W.
  • To ensure stability in a unity-gain configuration, add a capacitor (typically 10nF to 100nF) between the output and the inverting input to compensate for the internal pole. This helps to reduce the phase margin and prevent oscillations.
  • Use a star-grounding technique, where the analog and digital grounds are connected at a single point, and keep the analog and digital circuits separated. Also, use a solid ground plane and avoid routing digital signals near the analog signals.
  • While the AD8607ARZ can be used as a comparator, it's not the most suitable choice due to its relatively slow slew rate (0.5V/μs) and limited bandwidth (10kHz). A dedicated comparator like the AD8561 or AD9671 would be a better choice for high-speed comparator applications.
  • Use proper shielding, grounding, and filtering techniques to minimize EMI and RFI. Add ferrite beads or chokes to the power supply lines, and consider using a common-mode filter or a Pi-filter to reduce electromagnetic interference.

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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