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AD8616ARMZ-REEL - Analog Devices

Description: Precision Amplifiers DUAL, PRECISION CMOS RAIL-RAIL OP AMP

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AD8616ARMZ-REEL - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - RM-8 (MSOP)
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AD8616ARMZ-REEL - Analog Devices  - 3D model - Small Outline Packages - RM-8 (MSOP)
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AD8616ARMZ-REEL Details

  • Manufacturer Part Number:

    AD8616ARMZ-REEL

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Package Description:

    MSOP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    RM-8

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.00055 µA

  • Bias Current-Max (IIB) @25C:

    0.000001 µA

  • Common-mode Reject Ratio-Min:

    80 dB

  • Common-mode Reject Ratio-Nom:

    100 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    5e-7 µA

  • Input Offset Voltage-Max:

    60 µV

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Low-Bias:

    YES

  • Low-Offset:

    YES

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Nom:

    12 V/us

  • Supply Current-Max:

    5 mA

  • Supply Voltage Limit-Max:

    6 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    24

  • Voltage Gain-Min:

    1500000

  • Wideband:

    NO

  • Width:

    3 mm

AD8616ARMZ-REEL Frequently Asked Questions (FAQs)

  • The maximum power dissipation of the AD8616 is dependent on the package type and thermal resistance. For the MSOP package, the maximum power dissipation is approximately 450mW.
  • To minimize noise and EMI, keep the input and output traces short and away from noise sources, use a solid ground plane, and decouple the power supplies with capacitors. Additionally, use a low-ESR capacitor for the bypass capacitor.
  • The recommended capacitor value for the bypass capacitor (CBC) is 0.1uF to 10uF, with a low-ESR ceramic capacitor being a good choice.
  • Yes, the AD8616 can be used as a unity-gain buffer. However, it's recommended to add a small resistor (e.g., 10Ω to 100Ω) in series with the input to improve stability and reduce oscillations.
  • The input bias current of the AD8616 is typically around 10pA. To minimize the effect of input bias current, use a high-impedance source, and consider using a bias current cancellation circuit if necessary.

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AD8616ARMZ-REEL Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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