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AD8617ARMZ - Analog Devices

Description: Analog Devices AD8617ARMZ, Dual CMOS Op Amp, 0.4MHz Rail-Rail, 1.8 → 5 V, 8-Pin MSOP

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AD8617ARMZ - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - MSOP 1
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AD8617ARMZ Details

  • Manufacturer Part Number:

    AD8617ARMZ

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Package Description:

    ROHS COMPLIANT, MO-187AA, MSOP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    RM-8

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.00078 µA

  • Bias Current-Max (IIB) @25C:

    0.000001 µA

  • Common-mode Reject Ratio-Min:

    55 dB

  • Common-mode Reject Ratio-Nom:

    86 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    2200 µV

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Nom:

    0.1 V/us

  • Supply Current-Max:

    0.1 mA

  • Supply Voltage Limit-Max:

    6 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    350

  • Voltage Gain-Min:

    85000

  • Wideband:

    NO

  • Width:

    3 mm

AD8617ARMZ Frequently Asked Questions (FAQs)

  • The maximum power dissipation of the AD8617ARMZ is 670mW, which is calculated based on the maximum junction temperature (TJ) of 150°C and the thermal resistance (θJA) of 125°C/W.
  • To ensure stability, add a 10nF to 22nF capacitor in parallel with a 100Ω to 200Ω resistor between the output and the inverting input. This helps to reduce the phase margin and prevent oscillations.
  • Use a star-grounding technique, where all grounds are connected to a single point, and keep the analog and digital grounds separate. Also, keep the input and output traces short and away from each other to minimize noise and coupling.
  • While the AD8617ARMZ can be used as a comparator, it's not recommended due to its relatively slow slew rate (2.5V/μs) and limited bandwidth (28MHz). A dedicated comparator like the AD8561 or AD9671 would be a better choice.
  • Use ESD protection devices such as TVS diodes or ESD arrays on the input and output pins to protect the AD8617ARMZ from electrostatic discharge. Also, follow proper handling and storage procedures to prevent ESD damage.

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AD8617ARMZ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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