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AD9278BBCZ - Analog Devices

Description: Octal LNA/VGA/AAF/ADC and CW I/Q Demodulator

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PCB Footprints
AD9278BBCZ - Analog Devices PCB footprint - BGA - BGA - 144-Ball Chip Scale Package, Ball Grid Array
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3D Models
AD9278BBCZ - Analog Devices  - 3D model - BGA - 144-Ball Chip Scale Package, Ball Grid Array
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AD9278BBCZ Details

  • Manufacturer Part Number:

    AD9278BBCZ

  • Source Url Status Check Date:

    2013-05-01 14:56:30.57

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    BGA

  • Package Description:

    10 X 10 MM, ROHS COMPLIANT, MO-275EEAB-1, BGA-144

  • Pin Count:

    144

  • Manufacturer Package Code:

    BC-144-1

  • Country Of Origin:

    Singapore

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Additional Feature:

    ALSO OPERATES FROM 2.7V TO 3.6V SUPPLY

  • Analog IC - Other Type:

    ANALOG CIRCUIT

  • JESD-30 Code:

    S-PBGA-B144

  • JESD-609 Code:

    e1

  • Length:

    10 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    144

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.4 mm

  • Supply Voltage-Max (Vsup):

    1.9 V

  • Supply Voltage-Min (Vsup):

    1.7 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    10 mm

AD9278BBCZ Frequently Asked Questions (FAQs)

  • A good PCB layout for the AD9278BBCZ involves keeping the analog and digital grounds separate, using a solid ground plane, and minimizing the length of the signal traces. It's also recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To optimize the performance of the AD9278BBCZ in a noisy environment, use shielding, filtering, and grounding techniques to minimize electromagnetic interference (EMI). Also, use a low-pass filter at the input to remove high-frequency noise.
  • The AD9278BBCZ can support data rates up to 250 MSPS, but the actual data rate depends on the specific application and the quality of the input signal.
  • Calibration of the AD9278BBCZ involves adjusting the offset and gain of the analog-to-digital converter (ADC) to optimize its performance. This can be done using the on-chip calibration feature or through external calibration using a calibration signal.
  • The power consumption of the AD9278BBCZ depends on the operating frequency and the power supply voltage. Typically, it consumes around 1.2 W at 1.8 V and 250 MSPS.

Trust Checks

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AD9278BBCZ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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