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ADA4857-1YCPZ-R7 - Analog Devices

Description: High speed 850 MHz, −3 dB bandwidth (G = +1, RL = 1 kΩ, LFCSP) 750 MHz, −3 dB bandwidth (G = +1, RL = 1 kΩ, SOIC) 2800 V/μs slew rate Low distortion: −88 dBc at 10 MHz (G = +1, RL = 1 kΩ) Low power: 5 mA/amplifier at 10 V Low noise: 4.4 nV/√Hz Wide supply voltage range: 5 V to 10 V Power-down feature Available in 3 mm × 3 mm 8-lead LFCSP (single), 8-lead SOIC (single), and 4 mm × 4 mm 16-lead LFCSP (dual)

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ADA4857-1YCPZ-R7 - Analog Devices PCB footprint - Small Outline No-lead - Small Outline No-lead - 8-Lead Lead Frame Chip Scale Package [LFCSP_WD] 3 mm × 3 mm Body, Very Very Thin, Dual Lead (CP-8-13)
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3D Models
ADA4857-1YCPZ-R7 - Analog Devices  - 3D model - Small Outline No-lead - 8-Lead Lead Frame Chip Scale Package [LFCSP_WD] 3 mm × 3 mm Body, Very Very Thin, Dual Lead (CP-8-13)
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ADA4857-1YCPZ-R7 Details

  • Manufacturer Part Number:

    ADA4857-1YCPZ-R7

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFN

  • Package Description:

    LFCSP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    CP-8-13

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    3.3 µA

  • Bias Current-Max (IIB) @25C:

    3.3 µA

  • Common-mode Reject Ratio-Min:

    70 dB

  • Common-mode Reject Ratio-Nom:

    86 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    4500 µV

  • JESD-30 Code:

    S-XQCC-N8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    3

  • Neg Supply Voltage Limit-Max:

    -5.5 V

  • Neg Supply Voltage-Nom (Vsup):

    -5 V

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    SOLCC8,.11,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TR, 7 INCH

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.9 mm

  • Slew Rate-Min:

    0.7 V/us

  • Slew Rate-Nom:

    1 V/us

  • Supply Current-Max:

    5.5 mA

  • Supply Voltage Limit-Max:

    5.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    850000

  • Voltage Gain-Min:

    50000

  • Wideband:

    YES

  • Width:

    3 mm

ADA4857-1YCPZ-R7 Frequently Asked Questions (FAQs)

  • A good PCB layout for the ADA4857-1YCPZ-R7 involves keeping the input and output traces short and symmetrical, using a solid ground plane, and minimizing the distance between the device and the decoupling capacitors. A 4-layer PCB with a dedicated ground plane is recommended.
  • To ensure proper biasing, connect the VCC pin to a stable voltage source between 2.7V and 5.5V, and the GND pin to a solid ground plane. The VCC pin should be decoupled with a 10uF capacitor to GND, and the input pins should be biased to a voltage within the common-mode range.
  • The ADA4857-1YCPZ-R7 can drive capacitive loads up to 100pF. Exceeding this limit may cause instability or oscillations. If a larger capacitive load is required, consider adding a buffer stage or using a device with higher drive capability.
  • To minimize EMI, use a shielded enclosure, keep the device away from high-frequency sources, and use a low-pass filter or ferrite bead on the output. Additionally, ensure good PCB layout practices, such as keeping the signal traces short and away from the edge of the board.
  • The thermal resistance of the ADA4857-1YCPZ-R7 package is typically around 120°C/W. This means that for every watt of power dissipated, the junction temperature will rise by 120°C above the ambient temperature.

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ADA4857-1YCPZ-R7 Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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Part Image ADA4857-1YCPZ-RL Rochester Electronics LLC

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